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Seagate ST1.2 ST1.2 Series Product Manual - Page 52

TPCE_IO: I/O Address Range Description Field #1 Address = 170

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118H 11AH 11CH 11EH 120H 122H 124H 126H 128H 12AH 12CH 12EH C3H 41H 99H 27H 55H 4DH 5DH B6H 1EH EAH 61H 70H TPCE_INDX :(Configuration Table Entry Tuple) Config Entry Number (bit0..5) = 03 (Secondary I/O Mode) Default (bit6) = 1 Interface (bit7) = 1 (Interface Field Exist) TPCE_IF: (Interface Description Field) Interface Type (bit0..3) = 01 (I/O and Memory) BVDS active (bit4) = 0 WP active (bit5) = 0 READY active (bit6) = 1 MWAIT required (bit7) = 0 TPCE_FS: (Feature Selection Byte) Power (bit0,1) = 01 (Vcc Only) Timing (bit2) = 0 I/O (bit3) = 0 Interrupt (bit4) = 0 Memory (bit5,6) = 01 Misc (bit7) = 1 TPCE_PD (Power Description Structure) TPCE_PD: Parameter Selection Byte NomV (bit0) =1 MinV (bit1) = 1 MaxV (bit2) =1 PeakI (bit5) =1 TPCE_PD: Power Parameter Definition (NomV) Exponent (bit 0..2) = 5 (1V) - ->5.0V Mantissa (bit3..6) = A (5.0) TPCE_PD: Power Parameter Definition (MinV) Exponent (bit 0..2) = 5 (1V) - ->4.5V Mantissa (bit3..6) = 9 (4.5) TPCE_PD: Power Parameter Definition (MaxV) Exponent (bit 0..2) = 5 (1V) - ->5.5V Mantissa (bit3..6) = C (5.5) TPCE_PD: Power Parameter Definition (PeakI) Exponent (bit 0..2) = 6 (100mA) - -+- ->330mA Mantissa (bit3..6) = 6 (3) + Extension (bit7) = 1 (Extension Byte Exists) + TPCE_PD: Extension = 1Eh = +0.30 - -+ TPCE_IO: (I/O Space Address required for this configuration) I/O Address Lines (bit0..4) =A (1K byte boundary) Bus 16/8 (bit5,6) = 3 (Support 16/8 bit access) Range (bit7) = 1 (See I/O Range Description Byte) TPCE_IO: I/O Range Description Byte # of address range - 1 (bit0..3) = 1 (#of field = 2) Size Of Address (bit4,5) = 2 (2 byte address) Size Of Length (bit6,7) = 1 (1 byte length) TPCE_IO: I/O Address Range Description Field #1 Address = 170 46 ST1.2 Series Product Manual, Rev. B

Section	Page
1.0 Introduction 1	3
1.1 Disclaimer 2	3
1.2 Drive care 2	3
1.3 Handling precautions 2	3
2.0 Drive specifications 3	3
2.1 Power, access times and acoustics 3	3
2.2 Formatted capacity 5	3
2.3 Default logical geometry 5	3
2.4 Recording and interface technology 6	3
2.5 Physical characteristics 6	3
2.6 Time to ready 6	3
2.7 Power specifications 7	3
2.7.1 Power consumption 7	3
2.7.2 Conducted noise 9	3
2.7.3 Voltage tolerance 9	3
2.7.4 Power-management modes 10	3
2.8 Environmental specifications 11	3
2.8.1 Ambient temperature 11	3
2.8.2 Temperature gradient 11	3
2.8.3 Humidity 11	3
2.8.4 Altitude 11	3
2.8.5 Shock 12	3
2.8.6 Vibration 12	3
2.9 Acoustics 15	3
2.10 Electromagnetic immunity 15	3
2.11 Reliability 16	3
2.12 Agency certification 17	3
2.12.1 Safety certification 17	3
2.12.2 Electromagnetic compatibility 17	3
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive 17	3
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive 18	3
2.12.5 FCC verification 18	3
3.0 Configuring and mounting the drive 21	3
3.1 Handling and static discharge precautions 21	3
3.2 Drive installation 22	3
4.0 Interface description 25	3
4.1 Connector interface signals and connector pins 25	3
4.1.1 Flex interface connector signals 27	3
4.1.2 Supported ATA commands 29	3
4.1.3 Identify Device command 31	3
4.1.4 Set Features command 35	3
4.1.5 Card Information Structure (CIS) information for CF 37	3
5.0 Seagate Technology support services 49	3
Figure 1. ST1.2 Series CompactFlash+ disc drive 1	5
Figure 2. ST1.2 Series Flex (IDE interface) disc drive 1	5
Figure 3. ST1.2 Series breather hole location 2	5
Figure 4. ST1.2 Series improper handling example 2	5
Figure 5. Typical 3.3V startup and operation current profile 8	5
Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive 12	5
Figure 7. Drive axis definition for ST1.2 drives 12	5
Figure 8. ST1.2 Series proper handling example 21	5
Figure 9. ST1.2 Series improper handling example 21	5
Figure 10. CF model mechanical dimensions-top, side and end view 22	5
Figure 11. FX model mechanical dimensions-top, side and end view 23	5
1.0 Introduction	7
1.1 Disclaimer	8
1.2 Drive care	8
1.3 Handling precautions	8
2.0 Drive specifications	9
2.1 Power, access times and acoustics	9
2.2 Formatted capacity	11
2.3 Default logical geometry	11
2.4 Recording and interface technology	12
2.5 Physical characteristics	12
2.6 Time to ready	12
2.7 Power specifications	13
2.7.1 Power consumption	13
2.7.1.1 Typical current profile	14
2.7.2 Conducted noise	15
2.7.3 Voltage tolerance	15
2.7.4 Power-management modes	16
2.8 Environmental specifications	17
2.8.1 Ambient temperature	17
2.8.2 Temperature gradient	17
2.8.3 Humidity	17
2.8.3.1 Relative humidity	17
2.8.3.2 Wet bulb temperature	17
2.8.4 Altitude	17
2.8.5 Shock	18
2.8.5.1 Operating shock	18
2.8.5.2 Nonoperating shock	18
2.8.6 Vibration	18
2.8.6.1 Operating sweep sine vibration	19
2.8.6.2 Operating random vibration	19
2.8.6.3 Nonoperating sweep sine vibration	19
2.8.6.4 Nonoperating random vibration	20
2.8.6.5 Corrosive environment	20
2.9 Acoustics	21
2.10 Electromagnetic immunity	21
2.11 Reliability	22
2.12 Agency certification	23
2.12.1 Safety certification	23
2.12.2 Electromagnetic compatibility	23
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive	23
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive	24
2.12.5 FCC verification	24
3.0 Configuring and mounting the drive	27
3.1 Handling and static discharge precautions	27
3.2 Drive installation	28
4.0 Interface description	31
4.1 Connector interface signals and connector pins	31
4.1.1 Flex interface connector signals	33
4.1.2 Supported ATA commands	35
4.1.3 Identify Device command	37
4.1.4 Set Features command	41
4.1.5 Card Information Structure (CIS) information for CF	43
5.0 Seagate Technology support services	55
Index	61
A	61
B	61
C	61
D	61
E	61
F	61
G	61
H	61
I	61
K	61
L	61
M	62
N	62
O	62
P	62
R	62
S	62
T	62
V	62