Asus K8V-XE Motherboard DIY Troubleshooting Guide - Page 24
DDR-Liste quali, zierter Anbieter - motherboard
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DDR-Liste qualifizierter Anbieter In der folgenden Tabelle werden die PC3200 (DDR400)-Speichermodule aufgeführt, die für die Benutzung mit diesem Motherboard getestet und für gut befunden wurden. DDR400-Liste qualifizierter Anbieter (QVL) Größe 256MB 512MB 512MB 1024MB 256MB 256MB 512MB 512MB 1024MB 256MB 512MB 256MB 512MB 256MB 512MB 1024MB 256MB 512MB 512MB 512MB 1024MB 256MB 512MB 256MB 512MB 1024MB 512MB 256MB 512MB 512MB 256MB 512MB 256MB 512MB 256MB 512MB 256MB 512MB 512MB 256MB 256MB 512MB 512MB 256MB 256MB 512MB 256MB 512MB 256MB 512MB 1024MB 512MB 1024MB 256MB 512MB Anbieter Modus CL Marke Seite(n) Komponente DIMM-Unterstützung A BC KINGSTON KINGSTON KINGSTON KINGSTON KINGSTON KINGSTON KINGSTON KINGSTON KINGSTON SAMSUNG SAMSUNG Infineon Infineon Infineon Infineon Infineon CORSAIR CORSAIR CORSAIR CORSAIR CORSAIR Hynix Hynix Transcend Transcend Transcend A DATA A DATA A DATA A DATA KINGMAX KINGMAX crucial crucial TwinMOS TwinMOS TwinMOS TwinMOS TwinMOS V-DATA Winbond Winbond GEIL GEIL PSC PSC NANYA NANYA NANYA NANYA NANYA NANYA NANYA Novax Novax V58C2256804SAT5(ECC) V58C2256804SAT5(ECC) Heat-Sink Package Heat-Sink Package D3208DL3T-5A A2S56D30BTP V58C2256804SAT5 HY5DU12822BT-D43 HYB25D512800BE-5B K4H560838F-TCCC K4H560838F-TCCC HYB25D256800CE-5C HYB25D256800CE-5C HYB25D512160CE-5C HYB25D512800CE-5C HYB25D512800CE-5B W942508BH-5 Heat-Sink Package VS32M8-5 Heat-Sink Package Heat-Sink Package HY5DU56822DT-D43 HY5DU56822DT-D43 K4H560838F-TCCC K4H560838F-TCCC K4H510838B-TCCC K4H560838F-TCCC HY5DU56822CT-D43 HY5DU56822CT-D43 ADD8608A8A-5B KDL388P4LA-50 KDL388P4LA-50 Heat-Sink Package Heat-Sink Package TMD7608F8E50D TMD7608F8E50D TMD7608F8E50D TMD7608F8E50D TMD7608F8E50I VDD9616A8A-5C W942508CH-5 W942508CH-5 GL3LC32G88TG-35 GL3LC32G88TG-5A A2S56D30BTP A2S56D30BTP NT5DS32M8CT-5T NT5DS32M8CT-5T NT5DS32M16BT-5T NT5DS64M8BT-5T NT5DS64M8BT-5T NT5DS64M8CS-5T NT5DS64M8CS-5T C2S56D30TP-5 C2S56D30TP-5 N/A N/A SS N/A N/A DS N/A N/A DS N/A N/A DS N/A N/A SS N/A N/A SS N/A N/A DS N/A N/A SS N/A N/A DS N/A SAMSUNG SS N/A SAMSUNG DS 3 Infineon SS N/A Infineon DS 3 Infineon SS 3 Infineon SS 3 Infineon DS N/A N/A SS N/A N/A DS N/A N/A DS N/A N/A DS N/A N/A DS N/A N/A SS N/A N/A DS 3 SAMSUNG SS 3 SAMSUNG DS 3 SAMSUNG DS 3 SAMSUNG DS 3 Hynix SS 3 Hynix DS 2.5 N/A DS N/A N/A SS N/A N/A DS 2 Ballistix SS 2 Ballistix DS 2.5 TwinMOS SS 2.5 TwinMOS DS 2.5 TwinMOS SS 2.5 TwinMOS DS N/A TwinMOS DS N/A N/A SS 3 Winbond SS N/A Winbond DS N/A N/A DS N/A N/A SS 2.5 PSC SS 2.5 PSC DS N/A N/A SS N/A N/A DS N/A N/A SS N/A N/A SS N/A N/A DS N/A N/A SS N/A N/A DS 2.5 CEON SS 2.5 CEON DS KVR400X72C3A/256 KVR400X72C3A/512 KHX3200A/512 KHX3200ULK2/1G KVR400X64C3A/256 KVR400X64C3A/256 KVR400X64C3A/512 KVR400X64C3A/512 KVR400X64C3A/1G M368L3223FTN-CCC M368L6423FTN-CCC HYS64D32300HU-5-C HYS64D64320HU-5-C HYS64D32301HU-5-C HYS64D64300HU-5-C HYS64D128320HU-5-C CMX256A-3200C2PT CMX512-3200C2 VS512MB400 CMXP512-3200XL TWINX2048-3200C2 HYMD232646D8J-D43 HYMD264646D8J-D43 TS32MLD64V4F3 TS64MLD64V4F3 TS128MLD64V4J MDOSS6F3H41Y0N1E0Z MDOHY6F3G31Y0N1E0Z MDOHY6F3H41Y0N1E0Z MDOAD5F3H41Y0D1E02 MPXB62D-38KT3R MPXC22D-38KT3R BL3264Z402.8TG BL6464Z402.16TG M2G9I08AIATT9F081AADT M2G9J16AJATT9F081AADT M2G9I08A8ATT9F081AADT M2G9J16A8ATT9F081AADT M2G9J16A8ATT9F081CADT MDYVD6F4G2880B1E0H W9425GCDB-5 W9451GCDB-5 GL1GB3200DC GLX2563200UP AL5D8B53T-5B1K AL6D8B53T-5B1K NT256D64S88C0G-5T NT512D64S8HC0G-5T NT256D64SH4B0G-5T NT512D64S88B0G-5T NT1GD64S8HB0G-5T NT512D64S88C0GY-5T NT1GD64S8HC0GY-5T 96M425653CE-40TB6 96M451253CE-40TB6 V V V V V V V V V V V V V VV V VV V V VV V V V VV V V V VV V VV V VV V VV V VV V V V V V V V VV V V V VV V V V VV V V V V V V V V V V V V V V V VV V V V V VV V VV V VV V V V V V V V VV V V V V V V VV V VV V V V V V V V V (Fortsetzung auf der nächsten Seite) 1-12 Kapitel 1: Produkteinführung