Dell PowerEdge R640 EMC PowerEdge R640 Technical Specifications - Page 14

Table 15. Thermal restrictions configuration continued, Technical specifications

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Table 15. Thermal restrictions configuration (continued) Number Configuration of process Heatsink Processor/ DIMM blank DIMM blanks Maximum number of DIMM blanks Fan ors Two 1U 2-pipe heat sink for CPU=200/205W NOTE: *165 W and 150 W FO includes Intel Xeon Gold 6146, 6144, 6244 and 6246 processors. Table 16. DCPMM thermal restrictions configuration Configuration TDP Maximum ambient temperature PowerEdge R640 2.5 inch x10 hard drives (PCIe x3) 3.5 inch x4 hard drives (PCIe x2/x3) 2.5 inch x8 hard drives (PCIe x3/x2) 200/205 W 155/165 W FO* 165 W Gold 6146 150 W 6144 and 6244 150 W Gold 6240Y 30oC 35oC 35oC 35oC 35oC PowerEdge R640 2.5 inch x10 hard drives (PCIe x3) 3.5 inch x4 hard drives (PCIe x2/x3) 2.5 inch x8 hard drives (PCIe x3/x2) 70 to 165 W 35oC Fan requirement Heatsink Requirement High performance fans High performance heat sink High performance fans High performance heat sink NOTE: When installing DCPMMs for systems that support 200W or higher wattage processors, the ambient temperature of 30oC must be adhered to ensure proper cooling and to avoid excess processor throttling, which may impact system performance. Table 17. GPU thermal restrictions configuration TDP(Watts) PowerEdge R640 2.5 inch hard drives x 10 x2GPU in slot 1,3 PowerEdge R640 (2.5 inch hard drives x 8 x3GPU) Thermal restriction at 30oC Thermal restriction at 35oC Thermal restriction at 30oC Thermal restriction at 35oC 200/205 W 155/165 W FO* 165 W Gold 6146 150 W 6144 and 6244 150 W Gold 6240Y High performance fans and High performance heat sink required Not supported High performance fans and High performance heat sink required Not supported 70 to 165 W High performance fans and standard heat sink required Not supported High performance fans and standard heat sink required Not supported NOTE: PowerEdge R640 does not support x3 GPU T4 (PPGXG) in 2.5 inch x10 hard drive chassis. 14 Technical specifications

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Table 15. Thermal restrictions configuration (continued)
Configuration
Number
of
process
ors
Heatsink
Processor/
DIMM blank
DIMM
blanks
Maximum number of
DIMM blanks
Fan
Two 1U 2-pipe heat
sink for
CPU=200/205W
NOTE:
*165 W and 150 W FO includes Intel Xeon Gold 6146, 6144, 6244 and 6246 processors.
Table 16. DCPMM thermal restrictions configuration
Configuration
TDP
Maximum ambient
temperature
Fan requirement
Heatsink Requirement
PowerEdge R640
2.5 inch x10 hard drives
(PCIe x3)
3.5 inch x4 hard drives
(PCIe x2/x3)
2.5 inch x8 hard drives
(PCIe x3/x2)
200/205 W
155/165 W FO*
165 W Gold 6146
150 W 6144 and 6244
150 W Gold 6240Y
30
o
C
High performance fans
High performance heat
sink
35
o
C
35
o
C
35
o
C
35
o
C
PowerEdge R640
2.5 inch x10 hard drives
(PCIe x3)
3.5 inch x4 hard drives
(PCIe x2/x3)
2.5 inch x8 hard drives
(PCIe x3/x2)
70 to 165 W
35
o
C
High performance fans
High performance heat
sink
NOTE:
When installing DCPMMs for systems that support 200W or higher wattage processors, the ambient
temperature of 30
o
C must be adhered to ensure proper cooling and to avoid excess processor throttling, which may
impact system performance.
Table 17. GPU thermal restrictions configuration
TDP(Watts)
PowerEdge R640 2.5 inch hard drives x 10 x2GPU
in slot 1,3
PowerEdge R640 (2.5 inch hard drives x 8
x3GPU)
Thermal restriction
at 30
o
C
Thermal restriction at 35
o
C
Thermal restriction
at 30
o
C
Thermal restriction at
35
o
C
200/205 W
155/165 W FO*
165 W Gold 6146
150 W 6144 and 6244
150 W Gold 6240Y
High performance
fans and High
performance heat sink
required
Not supported
High performance
fans and High
performance heat sink
required
Not supported
70 to 165 W
High performance
fans and standard
heat sink required
Not supported
High performance
fans and standard
heat sink required
Not supported
NOTE:
PowerEdge R640 does not support x3 GPU T4 (PPGXG) in 2.5 inch x10 hard drive chassis.
14
Technical specifications