Dell PowerEdge R7525 EMC Technical Specifications - Page 24

Table 28. Thermal restriction matrix (continued) Configuration 8 x 2.5inch NVMe 16 x 2.5inch SAS 16 x 2.5inch NVMe 16 x 2.5inch SAS + 8 x 2.5inch NVMe 24 x 2.5inch NVMe Rear storage No Rear No Rear No Rear No Rear No Rear Drives Drives Drives Drives Drives 8 x 3.5inch No Rear Drives 12 x 3.5-inch No Rear Drives 2 x Rear 2.5-inch No Rear Fan Ambient temperatu re " and 24x2.5 " chassi s have 30°C limitat ion. NOTE: Three fan modules are required for single processor, and six fan modules are required for dual processor system. NOTE: If the DIMM is 128 GB and above in a12 x 3.5-inch chassis with CPU TDP/cTDP is greater than 200 W or 12 x 3.5" + x2 rear-drive chassis with CPU TDP/cTDP greater than 170 W. Table 29. GPU/FPGA thermal restriction matrix Configura tion (Front storage) Fan type Max CPU TDP/cTDP GPU/FPGA ( Ambient temperature ) T4 V100 (16 GB) V100S M10 Snow white RTX 6000 RTX8000 No Backpane HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 8 x 2.5- inch HPR NVMe 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 16 x 2.5inch SAS HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 16 x 2.5- inch VHP NVMe 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 16 x 2.5inch SAS + 8 x 2.5- VHP inch NVMe 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 8 x 3.5inch SAS HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C NOTE: GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems. NOTE: Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots. Table 30. Processor and heat sink matrix Heat sink STD HSK Processor TDP < 180 W 24 Technical specifications