Dell PowerEdge R7525 EMC Technical Specifications - Page 25

Heat sink, Processor TDP, All GPU/FGPA cards require 1U L-type HSK and GPU shroud., Label, Description

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Table 30. Processor and heat sink matrix (continued) Heat sink 2U HPR HSK L-type HSK Processor TDP >= 180 W Supports all TDP (system should be installed with GPU/FGPA/long PCIe cards) NOTE: All GPU/FGPA cards require 1U L-type HSK and GPU shroud. Table 31. Label reference Label STD HPR VHP HSK LP FH Description Standard High performance Very high performance Heat sink Low profile Full height Technical specifications 25

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Table 30. Processor and heat sink matrix (continued)
Heat sink
Processor TDP
2U HPR HSK
>= 180 W
L-type HSK
Supports all TDP (system should be installed with GPU/FGPA/long
PCIe cards)
NOTE:
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
Table 31. Label reference
Label
Description
STD
Standard
HPR
High performance
VHP
Very high performance
HSK
Heat sink
LP
Low profile
FH
Full height
Technical specifications
25