Dell PowerEdge R940xa EMC Technical Specifications - Page 27

• Comprehensive thermal management: The thermal control system regulates the system fan speeds based on feedback from system component temperature sensors, as well as for system inventory and subsystem power draw. Temperature monitoring includes components such as processors, DIMMs, chipset, system inlet air ambient, hard disk drives, NDC, and GPU. • Open and closed loop fan speed control: Open loop fan control uses system configuration to determine fan speed based on system inlet air temperature. Closed loop thermal control uses temperature feedback to dynamically adjust fan speeds based on system activity and cooling requirements. • User-configurable settings: With the understanding and realization that every customer has a unique set of circumstances or expectations from the system, in this generation of servers, we have introduced limited user-configurable settings in the iDRAC9 BIOS setup screen. For more information, see the Dell EMC PowerEdge system Installation and Service Manual on Dell.com/Support/ Manuals and "Advanced Thermal Control: Optimizing across Environments and Power Goals" on Dell.com. • Cooling redundancy: The system allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system. • Environmental Specifications: The optimized thermal management makes the R940xa reliable under a wide range of operating environments. Expanded operating temperature restrictions • The operating temperature is for a maximum altitude of 950 m for fresh air cooling • No cold start-ups below 5°C due to hard drive constraints • Apache Pass DIMM, NVDIMM, PCIeSSD and NVME are not supported • GPGPU configuration are not supported • LRDIMM > 32 GB are not supported in x4 socket configurations • DCPMMs are not supported. • Redundant power supply units are required • Non Dell qualified peripheral cards and /or peripheral cards greater than 25 W are not supported • Intel FPGA is not supported • Mellanox CX5 is not supported Fresh air restrictions Following table lists the configuration required for efficient cooling. Table 19. Fresh air restriction matrix Processors Number of Processor/ GPUs Number of drives Ambient temperatur e Fresh air support Fan type Processors Up to 304W Up to 304W processor processor (CPU 1/2) (CPU 3/4) Shroud All GPU/2&4 32x2.5-inch, 30 No AEP Six standard 4U height Remove the CPU w/ NVMe 2U height HSK air shroud A HSK (L-shape) All No 32x2.5-inch, 35 No AEP Six standard 4U height Install the air GPU /2&4 w/ NVMe 2U height HSK shroud A CPU HSK (L-shape) 205W / 200W / 165W_12C / 150W_8C CPU No GPU /4 CPU 32x2.5-inch, 35 w/o NVMe No AEP Six standard 2U height HSK 4U height Install the air HSK shroud A (L-shape) Processor TDP 32G Six standard 2U height HSK 4U height Install the air HSK shroud A (L-shape) Technical specifications 27