Dell PowerEdge R940xa EMC Technical Specifications - Page 30

System Backplane 8 x 2.5 inch SAS/ SATA CPU Thermal Design Power (TDP) Up to 205 W CPU heat sink Fan type 2U height HSK + Standard fan 4U height HSK GPU Ambient restriction ≥1 double-width/ 30°C single-width Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. Table 22. Particulate contamination specifications Particulate contamination Specifications Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. Corrosive dust • Air must be free of corrosive dust. • Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. Table 23. Gaseous contamination specifications Gaseous contamination Copper coupon corrosion rate Specifications