Dell PowerEdge T550 EMC Technical Specifications - Page 13

Thermal Matrix for all configurations, Table 20. Thermal restriction matrix continued

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Table 20. Thermal restriction matrix (continued) Drive Proces Fans Config sor uratio n CPU TDP Fan CPU HSK redund ancy TDP>1 TDP

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Table 20. Thermal restriction matrix (continued)
Drive
Config
uratio
n
Proces
sor
Fans
CPU
TDP
Fan
redund
ancy
CPU HSK
GPU support
TBU
suppor
t
CPU blank
F
a
n blank
Note
TDP>1
50 W
TDP<=
150 W
GPU<=
75 W
GPU>7
5 W
24 x
2.5
1 or 2
HPR
x7*
<=220
Yes
Yes
No
Yes
Fan
1/2/3/4/6/7/8
NOTE:
GPU riser 1
and 2 not
supported
1 or 2
HPR x8
<=220
Yes
Yes
Yes
No
NA
8 x 3.5
+ 8 x
2.5
(NVMe
)
1 or 2
HPR x4
<=220
No
HPR
HSK
STD
HSK
Yes
No
Yes
Yes for 1
processor
N
o
NA
1 or 2
HPR
x7*
<=220
Yes
Yes
No
Yes
Fan
1/2/3/4/6/7/8
NOTE:
GPU riser 1
and 2 not
supported
1 or 2
HPR x8
<=220
Yes
Yes
Yes
No
NA
NOTE:
OCP shroud are required for all drive configurations, even if the OCP card is not installed.
NOTE:
DIMM blanks are required for CPU TDP>185 W, but are not required for CPU TDP<=185 W.
NOTE:
GPU blank is required at GPU riser slot 2, when a GPU>75 W is installed at GPU riser slot 1.
NOTE:
HDD blanks are required for empty HDD slots.
NOTE:
*x5 and x7 fan count is applicable only for TBU configuration. Systems without TBU should not use x5 and x7 fan
counts.
NOTE:
When GPU is selected, HPR fan must be required.
NOTE:
GPU>75W must require fan redundancy (Fan quantity = 6 or 8).
NOTE:
GPU>75 W does not support TBU.
NOTE:
STD fans can also be upgraded to HPR fans.
Thermal Matrix for all configurations
8x, 16x, 24x 2.5-inch SAS/SATA
Configuration 1
8x 3.5-inch Configuration 2
8x 3.5-inch + 8x
2.5-inch NVMe
Configuration 3
Fan
STDx4
STDx8
HPRx4
HPRx7
x8
STDx3
x4
STDx6
x8
HPRx3
x4
HPRx5
x6 x7 x8
HPRx4
HPRx7
x8
Fan redundancy
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
Maximum DIMM
power
12 W
12 W
12 W
12 W
12 W
12 W
12 W
12 W
12 W
12 W
CPU
TDP
105 W
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
Technical specifications
13