Dell PowerEdge T550 EMC Technical Specifications - Page 15

Thermal air restrictions, Thermal air restrictions for different configurations

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Table 22. Gaseous contamination specifications Gaseous contamination Copper Coupon Corrosion rate Silver Coupon Corrosion rate Specifications 10 is not supported. ● Optic cable with spec 85C is required. ● Two PSUs are required. System performance may be reduced in the event of a PSU failure. ● STD fans configurations are not supported. ● 3x or 4x HPR fans configurations with CPU TDP > 165 W are not supported. ● TBU not supported. ● BOSS M.2 module not supported. ● Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported. ● NIC consuming power >= 25 W. For example: CX6 card. ● OCP transfer rate >25G or cooling tier > 10 not supported. ● Optic cable with spec 85C is required. ● Two PSUs are required. System performance may be reduced in the event of a PSU failure. Table 24. 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch drive configuration Standard Operating Support (ASHRAE A2 compliant) Extended ambient 40° C Operating Extended ambient 45° C Operating Support (ASHRAE A3 compliant) Support (ASHRAE A4 compliant) ● 4x STD fans support only processor with TDP 165 W are not ● TBU not supported. supported. ● Non-Dell qualified peripheral cards ● TBU not supported. and Channel devices (FW) cards are ● BOSS M.2 module is not supported. not supported. ● NIC consuming power >= 25 W not supported. For example: CX6 card. ● Non-Dell qualified peripheral cards and Channel devices (FW) cards are not supported. ● OCP transfer rate > 25G or cooling ● NIC consuming power >= 25 W. For tier > 10 not supported. example: CX6 card. Technical specifications 15

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Table 22. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper Coupon Corrosion rate
<300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal air restrictions
Thermal air restrictions for different configurations
Table 23. 8 x 3.5-inch drive configuration
Standard Operating Support
(ASHRAE A2 compliant)
NOTE:
All options supported unless
otherwise noted.
Extended ambient 40° C Operating
Support (ASHRAE A3 compliant)
Extended ambient 45° C Operating
Support (ASHRAE A4 compliant)
●
3x or 4x STD fans support only
processor with TDP<=185W
●
With STD fans, the following OCP
3.0 and NIC support only optic cable
with thermal spec 85C and power
<=1.2 W
○
Broadcom OCP 3.0 QP 25G
SFP28
○
Broadcom PCIe QP 25G
●
3x or 4x STD fans configurations not
supported.
●
6x or 8x STD fans configurations
with processor TDP > 120 W is not
supported.
●
TBU not supported.
●
Non-Dell qualified peripheral cards
and Channel devices (FW) cards not
supported.
●
NIC consuming power >= 25 W not
supported. For example: CX6 card.
●
OCP transfer rate > 25G or cooling
tier>10 is not supported.
●
Optic cable with spec 85C is
required.
●
Two PSUs are required. System
performance may be reduced in the
event of a PSU failure.
●
STD fans configurations are not
supported.
●
3x or 4x HPR fans configurations
with CPU TDP > 165 W are not
supported.
●
TBU not supported.
●
BOSS M.2 module not supported.
●
Non-Dell qualified peripheral cards
and Channel devices (FW) cards are
not supported.
●
NIC consuming power >= 25 W. For
example: CX6 card.
●
OCP transfer rate >25G or cooling
tier > 10 not supported.
●
Optic cable with spec 85C is
required.
●
Two PSUs are required. System
performance may be reduced in the
event of a PSU failure.
Table 24. 8 x 2.5-inch, 16 x 2.5-inch, 24 x 2.5-inch drive configuration
Standard Operating Support
(ASHRAE A2 compliant)
Extended ambient 40° C Operating
Support (ASHRAE A3 compliant)
Extended ambient 45° C Operating
Support (ASHRAE A4 compliant)
●
4x STD fans support only processor
with TDP<=185W
●
With STD fans, the following OCP
3.0 and NIC support only optic cable
with thermal Spec 85C and power
<=1.2 W
○
Broadcom OCP 3.0 QP 25G
SFP28
○
Broadcom PCIe QP 25G
●
4x STD fans configurations not
supported.
●
8x STD fans configurations with CPU
TDP > 120 W is not supported.
●
TBU not supported.
●
Non-Dell qualified peripheral cards
and Channel devices (FW) cards are
not supported.
●
NIC consuming power >= 25 W not
supported. For example: CX6 card.
●
OCP transfer rate > 25G or cooling
tier > 10 not supported.
●
STD fans configurations are not
supported.
●
4x HPR fans configurations with
processor TDP > 165 W are not
supported.
●
TBU not supported.
●
BOSS M.2 module is not supported.
●
Non-Dell qualified peripheral cards
and Channel devices (FW) cards are
not supported.
●
NIC consuming power >= 25 W. For
example: CX6 card.
Technical specifications
15