Gigabyte MH70-HD0 Manual - Page 13
Product Specifications
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1-2 Product Specifications CPU Support for Intel® Xeon® E5-2600 V3 series processors in the LGA2011 package L3 cache varies with CPU Supports Dual QuickPath Interconnect up to 9.6GT/s Enhanced Intel SpeedStep Technology (EIST) Support Intel Virtualization Technology (VT) Chipset Intel® C612 Express (Wellsburg) Chipset Memory LAN Expansion Slots Onboard Graphics Storage Interface 16 x 1.2V DDR4 DIMM sockets supporting up to 512GB RDIMM of system memory 16 x 1.2V DDR4 DIMM sockets supporting up to 1TB LRDIMM of system memory Four channel memory architecture DDR4 2133MHz RDIMM memory modules DDR4 2133MHz LR-DIMM memory modules Support for ECC RDIMM/LRDIMM memory modules Intel® 82599ES 10GbE LAN controller with QSFP+ (MH70-HD0 Only) Option Intel® Fortville 40GbE LAN controller with QSFP+ (MH70-HD0 Only) Intel® I350 GbE LAN controller (MH70-HD1 Only) Realtek RTL8211E supports server management LAN port 1 x PCI Express x16 slot, running at x16 (Gen3) 1 x Mezzanine Card, running at x8 (Gen3) ASPEED® AST2400 supports 16MB DDR3 VRAM Intel® C612 Express controller 6 x SATA3 6Gb/s connectors Support for Intel RSTe 4.0 with SATA RAID 0, RAID 1, 10, 5 USB Up to 4 USB 3.0 ports ( 2 on the back panel, 2 additional ports via the USB brackets connected to the internal USB headers) Internal Connectors 2 x 18-pin power connectors 1 x Front panel header 6 x SATA3 6Gb/s connectors 1 x USB 3.0 header 1 x TPM module connector 1 x SATA SPGIO header 1 x BMC SPGIO header 1 x PMBUS header 1 x IPMB connector 1 x Software RAID key connector 1 x Serial port header 1 x VGA port header Hardware Installation - 13 -