HP D2200sb HP BladeSystem c-Class architecture - Page 2

Introduction, Enclosures and hardware components, or refer - storage blade

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Introduction The BladeSystem c-Class architecture has provided a flexible "infrastructure in a box" since it was introduced in 2006. Here at HP, our engineers designed the BladeSystem c-Class architecture to make the compute, network, and storage resources modular and flexible, creating a general-purpose infrastructure that can accommodate your continually-changing business needs. This technology brief explains how the architecture supports such flexibility. Shared cooling, power, and management resources connect the flexible, modular components. This integrated aspect of BladeSystem c-Class-especially the Onboard Administrator and Integrated Lights-out (iLO) management-lets our engineers continually innovate in a standards-based environment. These management resources comprise a pre-boot configuration environment that allowed innovations such as Virtual Connect and Virtual Connect Flex-10 technologies. For more details about the innovations generated by the BladeSystem platform, see the other resources listed in the "For more information" section. This technology brief also includes a short description of the components within BladeSystem c-Class and explains how they work together, but it does not discuss details about all BladeSystem products. For product details, refer to the HP BladeSystem website at www.hp.com/go/bladesystem or refer to other technology briefs at http://h18004.www1.hp.com/products/servers/technology/whitepapers/proliant-servers.html#bl. Enclosures and hardware components An HP BladeSystem c-Class enclosure holds ProLiant and Integrity server blades, storage blades, I/O option blades, interconnect modules (switches, pass-thru modules, and Virtual Connect modules), a NonStop passive signal midplane, a passive power backplane, power supplies, fans, and Onboard Administrator modules. The HP BladeSystem c7000 enclosure (Figure 1) is optimized for enterprise data centers. A single c7000 enclosure is 10U high and can hold up to 16 server, storage, or I/O option blades and up to eight interconnect modules. 2

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Introduction
The BladeSystem c-Class architecture has provided a flexible “infrastructure in a box” since it was
introduced in 2006. Here at HP, our engineers designed the BladeSystem c-Class architecture to
make the compute, network, and storage resources modular and flexible, creating a general-purpose
infrastructure that can accommodate your continually-changing business needs. This technology brief
explains how the architecture supports such flexibility.
Shared cooling, power, and management resources connect the flexible, modular components. This
integrated aspect of BladeSystem c-Class—especially the Onboard Administrator and Integrated
Lights-out (iLO) management—lets our engineers continually innovate in a standards-based
environment. These management resources comprise a pre-boot configuration environment that
allowed innovations such as Virtual Connect and Virtual Connect Flex-10 technologies. For more
details about the innovations generated by the BladeSystem platform, see the other resources listed in
the “
For more information
” section.
This technology brief also includes a short description of the components within BladeSystem c-Class
and explains how they work together, but it does not discuss details about all BladeSystem products.
For product details, refer to the HP BladeSystem website at
www.hp.com/go/bladesystem
or refer to
other technology briefs at
.
Enclosures and hardware components
An HP BladeSystem c-Class enclosure holds ProLiant and Integrity server blades, storage blades,
I/O option blades, interconnect modules (switches, pass-thru modules, and Virtual Connect modules),
a NonStop passive signal midplane, a passive power backplane, power supplies, fans, and Onboard
Administrator modules.
The HP BladeSystem c7000 enclosure (Figure 1) is optimized for enterprise data centers. A single
c7000 enclosure is 10U high and can hold up to 16 server, storage, or I/O option blades and up to
eight interconnect modules.
2