HP D2200sb HP BladeSystem c-Class architecture - Page 21

Availability technologies, Redundant configurations, Reliable components, Reducing configuration time

Page 21 highlights

HP Virtual Connect Enterprise Manager is a software application that simplifies the management of large BladeSystem environments using Virtual Connect to control LAN and SAN connectivity. It lets you manage multiple c-Class enclosures using a single console application. More information about Virtual Connect Enterprise Manager is available at www.hp.com/go/vcem. Availability technologies The BladeSystem c-Class uses redundant configurations to eliminate single points of failure, and the architecture reduces the risk of component failures and the time required for changes. The BladeSystem c-Class employs multiple signal paths and redundant hot-pluggable components to provide maximum uptime for components in the enclosure. Redundant configurations The BladeSystem c-Class minimizes the chances of a failure by providing redundant power supplies, cooling fans, and interconnect modules. For example, customers have the option of using power supplies in an N+N redundant configuration or an N+1 configuration. The interconnect modules can be placed side-by-side for redundancy. And redundant Onboard Administrator modules can be used in an active-standby configuration. The c-Class architecture provides redundant paths using multiple facility power feeds into the enclosures, blade-to-interconnect bay connectivity, and blade-to-enclosure manager connectivity. Because all c-Class components are hot-pluggable, you can quickly re-establish a redundant configuration in the event of a failure. Reliable components HP took every opportunity in the c-Class architecture to design for reliability, especially for critical components that can be considered single points of failure. Customers sometimes ask if the NonStop signal midplane for the BladeSystem c-Class enclosure could be a single point of failure, since it is not replicated. We designed the midplane to mitigate that risk (as described in the "NonStop signal midplane scalability" section). In the unlikely event that an Onboard Administrator module fails, server blades and interconnect modules will all continue to operate normally. The module can be removed and replaced without affecting operations of the server blades and interconnect modules. A component's operating temperature can play a significant role in reliability. The mechanical design of the BladeSystem c-Class enclosures minimizes the operating temperature of components in all critical areas. Finally, Active Cool fan design and the Onboard Administrator's thermal monitoring of the entire system adds to the lifespan of components by making sure that the fans deliver adequate cooling to the entire enclosure. Because of its unique fan blade, housing, motor windings, bearings, and drive circuit, the Active Cool fan provides higher reliability than typical server fans. Reducing configuration time Like other ProLiant servers, the BladeSystem c-Class was designed with ease-of-use as a priority. Several important technologies in the BladeSystem c-Class reduce the amount of time needed to replace, upgrade, and configure systems: Onboard Administrator and the related Insight Display, Virtual Connect technology, and hot-plug devices. With the intelligence of the Onboard Administrator and the easy-to-use Insight Display panel, you can configure and troubleshoot systems in minutes, rather than hours or days. Adopting Virtual Connect technology removes administrative burdens from LAN and SAN administrators because they are not 21

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HP Virtual Connect Enterprise Manager is a software application that simplifies the management of
large BladeSystem environments using Virtual Connect to control LAN and SAN connectivity. It lets
you manage multiple c-Class enclosures using a single console application.
www.hp.com/go/vcem
More information about Virtual Connect Enterprise Manager is available at
.
Availability technologies
and the
ndant hot-pluggable components to
ents in the enclosure.
es,
cy. And redundant Onboard Administrator modules can be used
ity.
t-pluggable, you can quickly re-establish a redundant
configuration in the event of a failure.
not
dplane to mitigate that risk (as described in the “
NonStop signal
The BladeSystem c-Class uses redundant configurations to eliminate single points of failure,
architecture reduces the risk of component failures and the time required for changes. The
BladeSystem c-Class employs multiple signal paths and redu
provide maximum uptime for compon
Redundant configurations
The BladeSystem c-Class minimizes the chances of a failure by providing redundant power suppli
cooling fans, and interconnect modules. For example, customers have the option of using power
supplies in an N+N redundant configuration or an N+1 configuration. The interconnect modules can
be placed side-by-side for redundan
in an active-standby configuration.
The c-Class architecture provides redundant paths using multiple facility power feeds into the
enclosures, blade-to-interconnect bay connectivity, and blade-to-enclosure manager connectiv
Because all c-Class components are ho
Reliable components
HP took every opportunity in the c-Class architecture to design for reliability, especially for critical
components that can be considered single points of failure. Customers sometimes ask if the NonStop
signal midplane for the BladeSystem c-Class enclosure could be a single point of failure, since it is
replicated. We designed the mi
midplane scalability
” section).
In the unlikely event that an Onboard Administrator module fails, server blades and interconnect
modules will all continue to operate normally. The module can be removed and replaced without
sign
f
, bearings,
higher reliability than typical server fans.
Administrator and the related Insight Display,
n
technology removes administrative burdens from LAN and SAN administrators because they are not
affecting operations of the server blades and interconnect modules.
A component’s operating temperature can play a significant role in reliability. The mechanical de
of the BladeSystem c-Class enclosures minimizes the operating temperature of components in all
critical areas. Finally, Active Cool fan design and the Onboard Administrator’s thermal monitoring o
the entire system adds to the lifespan of components by making sure that the fans deliver adequate
cooling to the entire enclosure. Because of its unique fan blade, housing, motor windings
and drive circuit, the Active Cool fan provides
Reducing configuration time
Like other ProLiant servers, the BladeSystem c-Class was designed with ease-of-use as a priority.
Several important technologies in the BladeSystem c-Class reduce the amount of time needed to
replace, upgrade, and configure systems: Onboard
Virtual Connect technology, and hot-plug devices.
With the intelligence of the Onboard Administrator and the easy-to-use Insight Display panel, you ca
configure and troubleshoot systems in minutes, rather than hours or days. Adopting Virtual Connect
21