HP ML530 ProLiant ML530 High-Performance Technologies - Page 8
memory subsystem, The memory board contains five Reliability-Enhanced Memory Controllers REMCs. One - g2 specifications
UPC - 720591250669
View all HP ML530 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 8 highlights
ProLiant ML530 High-Performance Technologies memory subsystem The memory subsystem of the ProLiant ML530 G2 server is designed for high performance using PC1600 DDR SDRAM, which has an effective data rate of 1.6 GB/s. Combined with two-way interleaving (described below), the memory subsystem provides the bandwidth necessary to keep up with the 3.2-GB/s data transfer rate to and from the processor (Figure 7). This balanced configuration reduces latency of data transfers between memory and processors, further enhancing system performance. The ProLiant ML530 G2 server comes standard with a single memory board. The memory board has eight Dual Inline Memory Modules (DIMM) sockets for a total capacity of 16 GB, if 2-GB DIMMS are used in Standard Memory mode.1 The sockets are organized into four banks (A, B, C, and D) with two sockets in each bank (Figure 7). The memory board contains five Reliability-Enhanced Memory Controllers (REMCs). One REMC is dedicated to addressing. It identifies the specific location of the data in memory. The other four REMCs control the data transfers to and from the DIMMs. They serve as the bridge between the DDR memory bus and the system bus. figure 7. architecture of the ProLiant ML530 memory subsystem 1 For more information, see Compaq Advanced Memory Protection Technologies, document number TC020607TB available online at ftp://ftp.compaq.com/pub/supportinformation/papers/tc020607tb_rev0_us.pdf. 8