HP Spectre 15-bl000 Maintenance and Service Guide - Page 38

board each time the heat sink is removed. Thermal paste is used on the system board components

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2. Remove the heat sink (2) from the system board. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal paste is used on the system board components (1)(3) and the heat sink (2)(4). Reverse this procedure to install the heat sink. 32 Chapter 5 Removal and replacement procedures

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2.
Remove the heat sink
(2)
from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board each time the heat sink is removed. Thermal paste is used on the system board components
(1)(3)
and
the heat sink
(2)(4)
.
Reverse this procedure to install the heat sink.
32
Chapter 5
Removal and replacement procedures