Intel 521 Data Sheet - Page 13

Datasheet

13

Introduction

•

Retention mechanism (RM)

—Since the LGA775 socket does not include any mechanical

features for heatsink attach, a retention mechanism is required. Component thermal solutions

should attach to the processor via a retention mechanism that is independent of the socket.

•

Storage conditions

—Refers to a non-operational state. The processor may be installed in a

platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.

Under these conditions, processor lands should not be connected to any supply voltages, have

any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or

a device removed from packaging material) the processor must be handled in accordance with

moisture sensitivity labeling (MSL) as indicated on the packaging material.

•

Functional operation

—Refers to normal operating conditions in which all processor

specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are

satisfied.

1.2

References

Material and concepts available in the following documents may be beneficial when reading this

document.

§

Table 1-1. References

Document

Document Numbers/

Location

Intel

®

Pentium

®

4 Processor on 90 nm Process Specification Update

http://developer.intel.com/

design/Pentium4/

specupdt/302352.htm

Intel

®

Pentium

®

4 Processor on 90 nm Process in the 775-Land Package

Thermal Design Guidelines


design/Pentium4/guides/

302553.htm

Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket


design/Pentium4/guides/

302356.htm

Intel

®

Architecture Software Developer's Manual


design/pentium4/

manuals/index_new.htm

IA-32 Intel

®

Architecture Software Developer's Manual Volume 1: Basic

Architecture

IA-32 Intel

®

Architecture Software Developer's Manual Volume 2A: Instruction

Set Reference Manual A–M

IA-32 Intel

®

Architecture Software Developer's Manual Volume 2B: Instruction

Set Reference Manual, N–Z

IA-32 Intel

®

Architecture Software Developer's Manual Volume 3: System

Programming Guide

IA-32 Intel

®

Architecture and Intel® Extended Memory 64 Software

Developer's Manual Documentation Changes


design/pentium4/

manuals/index_new.htm

Section	Page
Contents	3
Revision History	7
Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Packaging Terminology	12
1.2 References	13
2 Electrical Specifications	15
2.1 FSB and GTLREF	15
2.2 Power and Ground Lands	15
2.3 Decoupling Guidelines	15
2.3.1 VCC Decoupling	16
2.3.2 FSB GTL+ Decoupling	16
2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking	16
2.4 Voltage Identification	17
2.4.1 Phase Lock Loop (PLL) Power and Filter	19
2.5 Reserved, Unused, FC and TESTHI Signals	20
2.6 FSB Signal Groups	21
2.7 GTL+ Asynchronous Signals	22
2.8 Test Access Port (TAP) Connection	23
2.9 FSB Frequency Select Signals (BSEL[2:0])	23
2.10 Absolute Maximum and Minimum Ratings	24
2.11 Processor DC Specifications	24
2.12 VCC Overshoot Specification	33
2.12.1 Die Voltage Validation	33
2.13 GTL+ FSB Specifications	34
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
3.9 Processor Land Coordinates	41
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	66
5 Thermal Specifications and Design Considerations	75
5.1 Processor Thermal Specifications	75
5.1.1 Thermal Specifications	75
5.1.2 Thermal Metrology	79
5.2 Processor Thermal Features	79
5.2.1 Thermal Monitor	79
5.2.2 Thermal Monitor 2	80
5.2.3 On-Demand Mode	81
5.2.4 PROCHOT# Signal	82
5.2.5 THERMTRIP# Signal	82
5.2.6 TCONTROL and Fan Speed Reduction	82
5.2.7 Thermal Diode	83
6 Features	85
6.1 Power-On Configuration Options	85
6.2 Clock Control and Low Power States	85
6.2.1 Normal State	86
6.2.2 HALT and Enhanced HALT Powerdown States	86
6.2.2.1 HALT Powerdown State	86
6.2.2.2 Enhanced HALT Powerdown State	86
6.2.3 Stop-Grant State	87
6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State	88
6.2.4.1 HALT Snoop State, Grant Snoop State	88
6.2.4.2 Enhanced HALT Snoop State	88
7 Boxed Processor Specifications	89
7.1 Mechanical Specifications	90
7.1.1 Boxed Processor Cooling Solution Dimensions	90
7.1.2 Boxed Processor Fan Heatsink Weight	91
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	91
7.2 Electrical Requirements	91
7.2.1 Fan Heatsink Power Supply	91
7.3 Thermal Specifications	93
7.3.1 Boxed Processor Cooling Requirements	93

Intel 521 Data Sheet - Page 13

References - pentium 4 processor

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