Intel 521 Data Sheet - Page 40
Package Insertion Specifications, Processor Mass Specification, Processor Materials, Processor - specs
UPC - 683728199029
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Package Mechanical Specifications 3.5 Package Insertion Specifications The Pentium 4 processor in the 775-land package can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide. 3.6 Processor Mass Specification The typical mass of the Pentium 4 processor in the 775-land package is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 3-3 lists some of the package components and associated materials. Table 3-3. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Lands Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Processor Markings Figure 3-5 and Figure 3-6 show the topside markings on the processor. These diagrams aid in the identification of the Pentium 4 processor in the 775-land package. Figure 3-5. Processor Top-Side Marking Example Frequency/L2Cache/Bus/ 775_VR_CONFIG_04x S-Spec/CountryofAssy FPO 2-DMatrixMark INTEL m ©'04 Pentium® 4 3.60GHz/1M/800/04B SLxxx [COO] [FPO] ATPO S/N UniqueUnit Identifier ATPO Serial# 40 Datasheet