Intel BLKD201GLY2A Product Specification - Page 50

Thermal Considerations - pdf

Get Intel BLKD201GLY2A PDF manuals and user guides View all Intel BLKD201GLY2A manuals
Add to My Manuals
Save this manual to your list of manuals

Page 50 highlights

Intel Desktop Board D201GLY2 Technical Product Specification 2.6 Thermal Considerations CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. Please refer to the Intel Celeron Processor 200 Series Thermal and Mechanical Design Guidelines (TMDG) at the link below for system thermal solution considerations http://download.intel.com/design/processor/designex/31854801.pdf The TMDG document contains guidelines for thermal metrology in evaluating a selected chassis with several parameters, such as ambient temperature, heatsink temperature and processor power measurement. For information on chassis selection, please refer to the case studies in the TMDG document. All the references mentioned are based on the assumption that there no changes are made to the reference thermal solution for the processor. All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (item A in Figure 13) can reach a temperature of up to 85 oC in an open chassis. 50

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
Intel Desktop Board D201GLY2 Technical Product Specification
50
2.6
Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. Please
refer to the
Intel Celeron Processor 200 Series Thermal and Mechanical Design
Guidelines (TMDG) at the link below for system thermal solution considerations
The TMDG document contains guidelines for thermal metrology in evaluating a
selected chassis with several parameters, such as ambient temperature, heatsink
temperature and processor power measurement.
For information on chassis selection,
please refer to the case studies in the TMDG document. All the references mentioned
are based on the assumption that there no changes are made to the reference thermal
solution for the processor.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader.
Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature.
Failure to do so could cause components to exceed their maximum case
temperature and malfunction.
For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit.
The processor
voltage regulator area (item A in Figure 13) can reach a temperature of up to 85
o
C in
an open chassis.