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Intel BLKD201GLY2A Product Specification - Page 52

Reliability, Environmental

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Intel Desktop Board D201GLY2 Technical Product Specification 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. Table 23 shows the MTBF value for each of the D201GLY2 board's manufacturing options. Table 23. MTBF Values Product Code MTBF Value LAD201GLY2T 300,543.9846 hours LAD201GLY2TA 81,610.66815 hours LAD201GLY2 311,451.7701 hours LAD201GLY2A 82,394.24 hours BOX201GLY2 311,451.7701 hours BLKD201GLY2A 82,394.24 hours 2.8 Environmental Table 24 lists the environmental specifications for the board. Table 24. Environmental Specifications Parameter Specification Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged -40 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board D201GLY2 Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	10
1.1.1 Feature Summary	10
1.1.2 Manufacturing Options	11
1.1.3 Board Layout	11
1.1.4 Block Diagram	14
1.2 Online Support	15
1.3 Processor	15
1.4 System Memory	16
1.5 Silicon Integrated Systems* Chipset	17
1.5.1 Graphics Subsystem	17
1.5.2 USB	17
1.5.3 IDE Support	18
1.5.4 Real-Time Clock, CMOS SRAM, and Battery	19
1.6 S-Video Output (Optional)	23
1.7 Legacy I/O Controller	23
1.7.1 Serial Port	24
1.7.2 Parallel Port	24
1.7.3 Keyboard and Mouse Interface	24
1.8 Audio Subsystem	24
1.8.1 Audio Subsystem Software	25
1.8.2 Audio Connectors	25
1.9 LAN Subsystem	26
1.9.1 LAN Subsystem Software	26
1.10 Hardware Management Subsystem	27
1.10.1 Fan Monitoring	27
1.11 Power Management	27
1.11.1 ACPI	28
1.11.2 Hardware Support	30
2 Technical Reference	35
2.1 Memory Map	35
2.2 Connectors and Headers	36
2.2.1 Back Panel Connectors	37
2.2.2 Component-side Connectors and Headers	38
2.2.3 Front Panel USB Headers	43
2.3 Jumper Blocks	44
2.3.1 Front Panel Audio Header/Jumper Block	45
2.3.2 BIOS Setup Configuration Jumper Block	46
2.4 Mechanical Considerations	47
2.4.1 Form Factor	47
2.5 Electrical Considerations	48
2.5.1 DC Loading	48
2.5.2 Add-in Board Considerations	48
2.5.3 Fan Header Current Capability	49
2.5.4 Power Supply Considerations	49
2.6 Thermal Considerations	50
2.7 Reliability	52
2.8 Environmental	52
2.9 Regulatory Compliance	53
2.9.1 Safety Standards	53
2.9.2 European Union Declaration of Conformity Statement	54
2.9.3 Product Ecology Statements	56
2.9.4 EMC Regulations	60
2.9.5 Product Certification Markings (Board Level)	62
3 Overview of BIOS Features	63
3.1 Introduction	63
3.2 BIOS Flash Memory Organization	64
3.3 Resource Configuration	64
3.3.1 PCI Autoconfiguration	64
3.3.2 PCI IDE Support	65
3.4 System Management BIOS (SMBIOS)	65
3.5 Legacy USB Support	66
3.6 BIOS Updates	66
3.6.1 Language Support	67
3.6.2 Custom Splash Screen	67
3.7 Boot Options	67
3.7.1 CD-ROM Boot	67
3.7.2 Network Boot	67
3.7.3 Booting Without Attached Devices	67
3.7.4 Changing the Default Boot Device During POST	68
3.8 Adjusting Boot Speed	68
3.8.1 Peripheral Selection and Configuration	68
3.8.2 BIOS Boot Optimizations	69
3.9 BIOS Security Features	70
4 Error Messages	71
4.1 BIOS Front-panel Power LED Codes	71
4.2 BIOS Error Messages	71