Intel BX80532PG3200D Data Sheet - Page 28

Electrical Specifications

28

Datasheet

2.

Excessive overshoot or undershoot on any signal will likely result in permanent damage to

the processor.

3.

Storage temperature is applicable to storage conditions only. In this scenario, the

processor must not receive a clock, and no lands can be connected to a voltage bias.

Storage within these limits will not affect the long-term reliability of the device. For

functional operation, please refer to the processor case temperature specifications.

4.

This rating applies to the processor and does not include any tray or packaging.

5.

Failure to adhere to this specification can affect the long-term reliability of the processor.

6.

For Intel® Pentium® processors in 22x22 mm package.

3.10

Processor DC Specifications

The processor DC specifications in this section are defined at the processor

core (pads) unless noted otherwise.

The tables list the DC specifications for the processor and are valid only while meeting

specifications for junction temperature, clock frequency, and input voltages. The

Highest Frequency Mode (HFM) and Lowest Frequency Mode (LFM) refer to the highest

and lowest core operating frequencies supported on the processor. Active mode load

line specifications apply in all states except in the Deep Sleep and Deeper Sleep states.

V

CC,BOOT

is the default voltage driven by the voltage regulator at power up in order to

set the VID values. Unless specified otherwise, all specifications for the processor are at

T

J

= 105



C. Read all notes associated with each parameter.

Section	Page
Intel® Pentium® Processor on 45-nm Process	1
Revision History	5
1 Introduction	7
1.1 Terminology	8
1.2 References	9
2 Low Power Features	11
2.1 Clock Control and Low-Power States	11
2.1.1 Core Low-Power State Descriptions	13
2.1.2 Package Low-power State Descriptions	14
2.2 Enhanced Intel SpeedStep® Technology	17
2.3 Extended Low-Power States	18
2.4 FSB Low Power Enhancements	19
2.5 Processor Power Status Indicator (PSI-2) Signal	19
3 Electrical Specifications	21
3.1 Power and Ground Pins	21
3.2 Decoupling Guidelines	21
3.2.1 VCC Decoupling	21
3.2.2 FSB AGTL+ Decoupling	21
3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking	21
3.3 Voltage Identification and Power Sequencing	22
3.4 Catastrophic Thermal Protection	25
3.5 Reserved and Unused Pins	25
3.6 FSB Frequency Select Signals (BSEL[2:0])	25
3.7 FSB Signal Groups	26
3.8 CMOS Signals	27
3.9 Maximum Ratings	27
3.10 Processor DC Specifications	28
4 Package Mechanical Specifications and Pin Information	33
4.1 Package Mechanical Specifications	33
4.2 Processor Pinout and Pin List	36
4.3 Alphabetical Signals Reference	59
5 Thermal Specifications and Design Considerations	67
5.1 Monitoring Die Temperature	69
5.1.1 Thermal Diode	69
5.1.2 Intel® Thermal Monitor	70
5.1.3 Digital Thermal Sensor	72
5.2 Out of Specification Detection	73

Intel BX80532PG3200D Data Sheet - Page 28

Processor DC Specifications

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