Intel BX80532PG3200D Data Sheet - Page 7

Introduction

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Introduction 1 Introduction Notes: This document contains electrical, mechanical and thermal specifications for the following processors: • The Intel® Pentium® support the Mobile Intel® 4 Series Express Chipset and Intel® ICH9M I/O controller. In this document 1. Intel Pentium processor are referred to as the processor 2. Mobile Intel 4 Series Express Chipset is referred as the GMCH. Key features include: • Dual-core processor for mobile with enhanced performance • Supports Intel architecture with Intel® Wide Dynamic Execution • Supports L1 cache-to-cache (C2C) transfer • On-die, primary 32-KB instruction cache and 32-KB, write-back data cache in each core • The processor have an on-die, 1-MB second-level, shared cache with Advanced Transfer Cache architecture • Streaming SIMD extensions 2 (SSE2), streaming SIMD extensions 3 (SSE3), and supplemental streaming SIMD extensions 3 (SSSE3) • Enhanced Intel SpeedStep® Technology • The processors are offered at 800-MHz, source-synchronous front side bus (FSB) • Digital thermal sensor (DTS) • Intel® 64 architecture • Enhanced Multi-Threaded Thermal Management (EMTTM) • Processor offered in Micro-FCPGA packaging technology • Execute Disable Bit support for enhanced security • Half ratio support (N/2) for core to bus ratio Datasheet 7

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Datasheet
7
Introduction
1
Introduction
This document contains electrical, mechanical and thermal specifications for the
following processors:
•
The Intel® Pentium® support the Mobile Intel® 4 Series Express Chipset and
Intel® ICH9M I/O controller.
Notes:
In this document
1.
Intel Pentium processor are referred to as the processor
2.
Mobile Intel 4 Series Express Chipset is referred as the GMCH.
Key features include:
•
Dual-core processor for mobile with enhanced performance
•
Supports Intel architecture with Intel® Wide Dynamic Execution
•
Supports L1 cache-to-cache (C2C) transfer
•
On-die, primary 32-KB instruction cache and 32-KB, write-back data cache in each
core
•
The processor have an on-die, 1-MB second-level, shared cache with Advanced
Transfer Cache architecture
•
Streaming SIMD extensions 2 (SSE2), streaming SIMD extensions 3 (SSE3), and
supplemental streaming SIMD extensions 3 (SSSE3)
•
Enhanced Intel SpeedStep® Technology
•
The processors are offered at 800-MHz, source-synchronous front side bus (FSB)
•
Digital thermal sensor (DTS)
•
Intel® 64 architecture
•
Enhanced Multi-Threaded Thermal Management (EMTTM)
•
Processor offered in Micro-FCPGA packaging technology
•
Execute Disable Bit support for enhanced security
•
Half ratio support (N/2) for core to bus ratio