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Intel BX80532PG3200D Data Sheet - Page 9

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Introduction 1.2 References Material and concepts available in the following documents may be beneficial when reading this document. Document Intel® Pentium® Processor on 45-nm Technology Specification Update Mobile Intel® 4 Series Express Chipset Family Datasheet Mobile Intel® 4 Series Express Chipset Family Specification Update Intel® I/O Controller Hub 9 (ICH9)/ I/O Controller Hub 9M (ICH9M) Datasheet Intel® I/O Controller Hub 9 (ICH9)/ I/O Controller Hub 9M (ICH9M) Specification Update Intel® 64 and IA-32 Architectures Software Developer's Manuals Volume 1: Basic Architecture Volume 2A: Instruction Set Reference, A-M Volume 2B: Instruction Set Reference, N-Z Volume 3A: System Programming Guide Volume 3B: System Programming Guide Document Number 320122 320123 316972 316973 253665 253666 253667 253668 253669 NOTE: Contact your Intel representative for the latest revision of this document. § Datasheet 9

Section	Page
Intel® Pentium® Processor on 45-nm Process	1
Revision History	5
1 Introduction	7
1.1 Terminology	8
1.2 References	9
2 Low Power Features	11
2.1 Clock Control and Low-Power States	11
2.1.1 Core Low-Power State Descriptions	13
2.1.2 Package Low-power State Descriptions	14
2.2 Enhanced Intel SpeedStep® Technology	17
2.3 Extended Low-Power States	18
2.4 FSB Low Power Enhancements	19
2.5 Processor Power Status Indicator (PSI-2) Signal	19
3 Electrical Specifications	21
3.1 Power and Ground Pins	21
3.2 Decoupling Guidelines	21
3.2.1 VCC Decoupling	21
3.2.2 FSB AGTL+ Decoupling	21
3.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking	21
3.3 Voltage Identification and Power Sequencing	22
3.4 Catastrophic Thermal Protection	25
3.5 Reserved and Unused Pins	25
3.6 FSB Frequency Select Signals (BSEL[2:0])	25
3.7 FSB Signal Groups	26
3.8 CMOS Signals	27
3.9 Maximum Ratings	27
3.10 Processor DC Specifications	28
4 Package Mechanical Specifications and Pin Information	33
4.1 Package Mechanical Specifications	33
4.2 Processor Pinout and Pin List	36
4.3 Alphabetical Signals Reference	59
5 Thermal Specifications and Design Considerations	67
5.1 Monitoring Die Temperature	69
5.1.1 Thermal Diode	69
5.1.2 Intel® Thermal Monitor	70
5.1.3 Digital Thermal Sensor	72
5.2 Out of Specification Detection	73