Intel BX80532PG3200D Data Sheet - Page 67
Thermal Specifications and Design Considerations
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Thermal Specifications and Design Considerations 5 Thermal Specifications and Design Considerations Caution: A complete thermal solution includes both component and system-level thermal management features. To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed so the processor remains within the minimum and maximum junction ltiesmtepdeirnattuhreet(aTbJl)esspbeecliofiwcations at the corresponding thermal design power (TDP) value Operating the processor outside these operating limits may result in permanent damage to the processor and potentially other components in the system. Datasheet 67
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Datasheet
67
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
A complete thermal solution includes both component and system-level thermal
management features. To allow for the optimal operation and long-term reliability of
Intel processor-based systems, the system/processor thermal solution should be
designed so the processor remains within the minimum and maximum junction
temperature (T
J
) specifications at the corresponding thermal design power (TDP) value
listed in the tables below
Caution:
Operating the processor outside these operating limits may result in permanent
damage to the processor and potentially other components in the system.