Intel D525MW Product Specification - Page 5

Intel D525MW Manual

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Contents 1 Product Description ...9 1.1 Overview...9 1.1.1 Feature Summary ...9 1.1.2 Board Layout ...11 1.1.3 Block Diagram ...13 1.2 Online Support...14 1.3 Processor ...14 1.3.1 Intel® D525 Graphics Subsystem ...15 1.4 System Memory ...16 1.5 Intel® NM10 Express Chipset...17 1.5.2 USB ...19 1.5.3 SATA Support ...19 1.6 Real-Time Clock Subsystem ...20 1.7 Legacy I/O Controller ...20 1.8 LAN Subsystem ...21 1.8.1 LAN Subsystem Drivers ...21 1.8.2 RJ-45 LAN Connector with Integrated LEDs ...22 1.9 Audio Subsystem...23 1.9.1 Audio Subsystem Software ...24 1.9.2 Audio Connectors and Headers ...24 1.10 Hardware Management Subsystem ...25 1.10.1 Hardware Monitoring...25 1.10.2 Thermal Monitoring ...26 1.11 Power Management ...27 1.11.1 ACPI...27 1.11.2 Hardware Support ...30 2 Technical Reference ...33 2.1 Memory Map...2.1.1 Addressable Memory...2.2 Connectors and Headers...2.2.1 Back Panel ...2.2.2 Component-side Connectors and Headers ...2.3 BIOS Configuration Jumper Block...2.4 Mechanical Considerations ...2.4.1 Form Factor...2.5 Electrical Considerations ...2.5.1 Fan Header Current Capability...2.5.2 Add-in Board Considerations ...2.6 Thermal Considerations ...2.6.1 Passive Heatsink Design in a Passive System Environment ...33 33 36 37 39 49 51 51 52 52 52 52 54 v

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Contents
1
Product Description
..............................................................
9
1.1
Overview
..........................................................................................
9
1.1.1
Feature Summary
..................................................................
9
1.1.2
Board Layout
.......................................................................
11
1.1.3
Block Diagram
.....................................................................
13
1.2
Online Support
................................................................................
14
1.3
Processor
.......................................................................................
14
1.3.1
Intel
®
D525 Graphics Subsystem
............................................
15
1.4
System Memory
..............................................................................
16
1.5
Intel
®
NM10 Express Chipset
.............................................................
17
1.5.2
USB
...................................................................................
19
1.5.3
SATA Support
......................................................................
19
1.6
Real-Time Clock Subsystem
..............................................................
20
1.7
Legacy I/O Controller
.......................................................................
20
1.8
LAN Subsystem
...............................................................................
21
1.8.1
LAN Subsystem Drivers
.........................................................
21
1.8.2
RJ-45 LAN Connector with Integrated LEDs
..............................
22
1.9
Audio Subsystem
.............................................................................
23
1.9.1
Audio Subsystem Software
....................................................
24
1.9.2
Audio Connectors and Headers
...............................................
24
1.10
Hardware Management Subsystem
....................................................
25
1.10.1
Hardware Monitoring
.............................................................
25
1.10.2
Thermal Monitoring
..............................................................
26
1.11
Power Management
.........................................................................
27
1.11.1
ACPI
...................................................................................
27
1.11.2
Hardware Support
................................................................
30
2
Technical Reference
............................................................
33
2.1
Memory Map
...................................................................................
33
2.1.1
Addressable Memory
.............................................................
33
2.2
Connectors and Headers
...................................................................
36
2.2.1
Back Panel
..........................................................................
37
2.2.2
Component-side Connectors and Headers
................................
39
2.3
BIOS Configuration Jumper Block
.......................................................
49
2.4
Mechanical Considerations
................................................................
51
2.4.1
Form Factor
.........................................................................
51
2.5
Electrical Considerations
...................................................................
52
2.5.1
Fan Header Current Capability
................................................
52
2.5.2
Add-in Board Considerations
..................................................
52
2.6
Thermal Considerations
....................................................................
52
2.6.1
Passive Heatsink Design in a Passive System Environment
.........
54