Intel DC3217IYE Technical Product Specification - Page 11

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 2 summarizes the major features of the board. Table 2. Feature Summary Form Factor Processor Memory Chipset Graphics Audio Peripheral Interfaces Expansion Capabilities BIOS 4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters) • Soldered-down Intel® Core™ i3-3217U processor with up to 17 W TDP ― Integrated graphics ― Integrated memory controller • Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) sockets • Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SO-DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® QS77 Express Chipset consisting of the Intel® QS77 Express Platform Controller Hub (PCH) • Integrated graphics support for processors with Intel® Graphics Technology: ― Two High Definition Multimedia Interface* (HDMI*) back panel connectors Intel® High Definition Audio via the HDMI v1.4a interfaces • USB 2.0 ports: ― Three front panel ports (via one dual-port internal header and one front panel connector) ― Two ports are implemented with vertical back panel connectors ― One port is reserved for the PCI Express* Half-Mini Card ― One port is reserved for the PCI Express Full-Mini Card • SATA port: ― One internal mSATA port (PCI Express Full-Mini Card) for SSD support • One PCI Express Half-Mini Card connector • One PCI Express Full-Mini Card connector • Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) continued 11