Intel DH57DD Product Specification - Page 56
Thermal Considerations
View all Intel DH57DD manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 56 highlights
Intel Desktop Board DH57DD Technical Product Specification 2.6 Thermal Considerations CAUTION Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION The ambient temperature must not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. 56