Intel DH57DD Product Specification - Page 59
Reliability, Environmental
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Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 40 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the board is 165,378 hours. 2.8 Environmental Table 36 lists the environmental specifications for the board. Table 36. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +60 °C 0 °C to +40 °C 50 g trapezoidal waveform Velocity change of 170 inches/second² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)