Intel DZ68PL Technical product specification - Page 59

Reliability, Environmental

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Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 253,083 hours. 2.8 Environmental Table 33 lists the environmental specifications for the board. Table 33. Environmental Specifications Parameter Specification Temperature Non-Operating -20 °C to +70 °C (Note) Operating 0 °C to +55 °C The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and 1 inch above the board, in a closed chassis, while the system is in operation. Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s² Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)

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Technical Reference
59
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 55 ºC ambient.
The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from
predicted data at 55 ºC.
The MTBF for the board is 253,083 hours.
2.8
Environmental
Table 33 lists the environmental specifications for the board.
Table 33.
Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-20
°
C to +70
°
C
(Note)
Operating
0
°
C to +55
°
C
The operating temperature of the board may be determined by measuring the
air temperature from within 1 inch of the edge of the chipset/PCH heatsink and
1 inch above the board, in a closed chassis, while the system is in operation.
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz:
0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz:
0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz:
0.015 g² Hz (flat)
40 Hz to 500 Hz:
0.015 g² Hz sloping down to 0.00015 g² Hz
Note: Before attempting to operate this board, the overall temperature of the board must be above the
minimum operating temperature specified. It is recommended that the board temperature be at least
room temperature before attempting to power on the board.