Intel DZ68PL Technical product specification - Page 9

Error Messages and Beep Codes, Regulatory Compliance and Battery Disposal Information, s,

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Contents 4 Error Messages and Beep Codes 4.1 Speaker 71 4.2 BIOS Beep Codes 71 4.3 Front-panel Power LED Blink Codes 72 4.4 BIOS Error Messages 72 4.5 Port 80h POST Codes 73 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 79 5.1.1 Safety Standards 79 5.1.2 European Union Declaration of Conformity Statement 80 5.1.3 Product Ecology Statements 81 5.1.4 EMC Regulations 83 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 86 5.1.6 Regulatory Compliance Marks (Board Level 87 5.2 Battery Disposal Information 88 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 20 4. Back Panel Audio Connectors 26 5. LAN Connector LED Locations 28 6. Thermal Sensors and Fan Headers 30 7. Location of the Standby Power LED 37 8. Detailed System Memory Address Map 40 9. Back Panel Connectors 42 10. Component-side Connectors and Headers 43 11. Connection Diagram for Front Panel Header 49 12. Connection Diagram for Front Panel USB 2.0 Headers 51 13. Location of the Jumper Block 52 14. Board Dimensions 54 15. Localized High Temperature Zones 57 Tables 1. Feature Summary 11 2. Components Shown in Figure 1 14 3. Supported Memory Configurations 19 4. Audio Jack Support 25 5. LAN Connector LED States 28 6. Effects of Pressing the Power Switch 31 7. Power States and Targeted System Power 32 8. Wake-up Devices and Events 33 9. System Memory Map 41 ix

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Contents
ix
4
Error Messages and Beep Codes
4.1
Speaker
..........................................................................................
71
4.2
BIOS Beep Codes
.............................................................................
71
4.3
Front-panel Power LED Blink Codes
.....................................................
72
4.4
BIOS Error Messages
........................................................................
72
4.5
Port 80h POST Codes
........................................................................
73
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
......................................................................
79
5.1.1
Safety Standards
...................................................................
79
5.1.2
European Union Declaration of Conformity Statement
................
80
5.1.3
Product Ecology Statements
...................................................
81
5.1.4
EMC Regulations
...................................................................
83
5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
86
5.1.6
Regulatory Compliance Marks (Board Level)
.............................
87
5.2
Battery Disposal Information
..............................................................
88
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
..................................................................................
15
3.
Memory Channel and DIMM Configuration
............................................
20
4.
Back Panel Audio Connectors
.............................................................
26
5.
LAN Connector LED Locations
.............................................................
28
6.
Thermal Sensors and Fan Headers
......................................................
30
7.
Location of the Standby Power LED
.....................................................
37
8.
Detailed System Memory Address Map
................................................
40
9.
Back Panel Connectors
......................................................................
42
10. Component-side Connectors and Headers
............................................
43
11. Connection Diagram for Front Panel Header
.........................................
49
12. Connection Diagram for Front Panel USB 2.0 Headers
...........................
51
13. Location of the Jumper Block
.............................................................
52
14. Board Dimensions
.............................................................................
54
15. Localized High Temperature Zones
.....................................................
57
Tables
1.
Feature Summary
.............................................................................
11
2.
Components Shown in Figure 1
..........................................................
14
3.
Supported Memory Configurations
......................................................
19
4.
Audio Jack Support
...........................................................................
25
5.
LAN Connector LED States
.................................................................
28
6.
Effects of Pressing the Power Switch
...................................................
31
7.
Power States and Targeted System Power
...........................................
32
8.
Wake-up Devices and Events
.............................................................
33
9.
System Memory Map
........................................................................
41