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Seagate ST33000651SS Constellation ES.2 SAS Product Manual - Page 51

Cooling

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11.2 Cooling Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the drive will not exceed temperature conditions specified in Section 7.5.1, "Temperature." The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and disk assembly (HDA). You should confirm that adequate heat removal is provided using the temperature measurement guidelines described in Section 7.5.1. Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 7.5.1 in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow to the electronics and HDA. Also, the shortest possible path between the air inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat sources within the rack, cabinet, or drawer environment. If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 9. The air-flow patterns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guidelines of Section 7.5.1 are met. Above unit Under unit Note. Air flows in the direction shown (back to front) or in reverse direction (front to back) Note. Air flows in the direction shown or in reverse direction (side to side) Figure 9. Air flow Above unit Under unit Note. Image is for reference only, may not represent actual drive. Constellation ES.2 SAS Product Manual, Rev. C 43

Section	Page
1.0 Seagate Technology support services	9
2.0 Scope	10
3.0 Applicable standards and reference documentation	11
3.1 Standards	11
3.1.1 Electromagnetic compatibility	11
3.1.1.1 Electromagnetic susceptibility	11
3.1.2 Electromagnetic compliance	12
3.1.3 European Union Restriction of Hazardous Substances (RoHS)	13
3.1.4 China Restriction of Hazardous Substances (RoHS) Directive	13
3.2 Reference documents	14
4.0 General description	15
4.1 Standard features	16
4.2 Media description	16
4.3 Performance	16
4.4 Reliability	17
4.5 Formatted capacities	17
4.6 Programmable drive capacity	17
4.7 Factory-installed options	17
5.0 Performance characteristics	18
5.1 Internal drive characteristics	18
5.2 Seek performance characteristics	18
5.2.1 Access time	18
5.2.2 Format command execution time for 512-byte sectors (minutes)	19
5.2.3 General performance characteristics	19
5.3 Start/stop time	19
5.4 Prefetch/multi-segmented cache control	20
5.5 Cache operation	20
5.5.1 Caching write data	21
5.5.2 Prefetch operation	21
6.0 Reliability specifications	22
6.1 Error rates	22
6.1.1 Recoverable Errors	22
6.1.2 Unrecoverable Errors	22
6.1.3 Seek errors	23
6.1.4 Interface errors	23
6.2 Reliability and service	23
6.2.1 Annualized Failure Rate (AFR) and Mean Time Between Failure (MTBF)	23
6.2.2 Preventive maintenance	23
6.2.3 Hot plugging the drive	23
6.2.4 S.M.A.R.T.	24
6.2.5 Thermal monitor	25
6.2.6 Drive Self Test (DST)	26
6.2.6.1 DST failure definition	26
6.2.6.2 Implementation	26
6.2.7 Product warranty	28
7.0 Physical/electrical specifications	29
7.1 PowerChoiceTM power management	29
7.1.1 PowerChoice reporting methods	30
7.2 AC power requirements	30
7.3 DC power requirements	30
7.3.1 Conducted noise immunity	32
7.3.2 Power sequencing	32
7.3.3 Current profiles	33
7.4 Power dissipation	34
7.5 Environmental limits	36
7.5.1 Temperature	36
7.5.2 Relative humidity	36
7.5.3 Effective altitude (sea level)	37
7.5.4 Shock and vibration	37
7.5.4.1 Shock	37
7.5.4.2 Vibration	39
7.5.5 Acoustics	39
7.5.6 Air cleanliness	39
7.5.7 Corrosive environment	39
7.5.8 Electromagnetic susceptibility	40
7.6 Mechanical specifications	41
8.0 About FIPS	42
9.0 About self-encrypting drives	43
9.1 Data encryption	43
9.2 Controlled access	43
9.2.1 Admin SP	43
9.2.2 Locking SP	43
9.2.3 Default password	44
9.3 Random number generator (RNG)	44
9.4 Drive locking	44
9.5 Data bands	44
9.6 Cryptographic erase	44
9.7 Authenticated firmware download	45
9.8 Power requirements	45
9.9 Supported commands	45
9.10 RevertSP	45
10.0 Defect and error management	46
10.1 Drive internal defects/errors	46
10.2 Drive error recovery procedures	46
10.3 SAS system errors	47
10.4 Background Media Scan	47
10.5 Media Pre-Scan	48
10.6 Deferred Auto-Reallocation	48
10.7 Idle Read After Write	48
10.8 Protection Information (PI)	49
10.8.1 Levels of PI	49
10.8.2 Setting and determining the current Type Level	49
10.8.3 Identifying a Protection Information drive	49
11.0 Installation	50
11.1 Drive orientation	50
11.2 Cooling	51
11.3 Drive mounting	52
11.4 Grounding	52
12.0 Interface requirements	53
12.1 SAS features	53
12.1.1 task management functions	53
12.1.2 task management responses	53
12.2 Dual port support	54
12.3 SCSI commands supported	55
12.3.1 Inquiry data	59
12.3.2 Mode Sense data	59
12.4 Miscellaneous operating features and conditions	62
12.4.1 SAS physical interface	63
12.4.2 Physical characteristics	66
12.4.3 Connector requirements	66
12.4.4 Electrical description	66
12.4.5 Pin descriptions	66
12.4.6 SAS transmitters and receivers	67
12.4.7 Power	67
12.5 Signal characteristics	67
12.5.1 Ready LED Out	67
12.5.2 Differential signals	68
12.6 SAS-2 Specification Compliance	68
12.7 Additional information	68
Numerics	69
A	69
B	69
C	69
D	69
E	70
F	70
G	70
H	70
I	70
J	70
K	70
L	71
M	71
N	71
O	71
P	71
Q	72
R	72
S	72
T	72
U	73
V	73
W	73

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Constellation ES.2 SAS Product Manual, Rev. C

11.2

Cooling

Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding

the drive will not exceed temperature conditions specified in Section 7.5.1, "Temperature."

The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and

head and disk assembly (HDA). You should confirm that adequate heat removal is provided using the

temperature measurement guidelines described in Section 7.5.1.

Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 7.5.1

in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is

created while providing air flow to the electronics and HDA. Also, the shortest possible path between the air

inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat sources

within the rack, cabinet, or drawer environment.

If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 9. The air-flow

patterns are created by one or more fans, either forcing or drawing air as shown in the illustrations.

Conduction, convection, or other forced air-flow patterns are acceptable as long as the temperature

measurement guidelines of Section 7.5.1 are met.

Figure 9.

Air flow

Note.

Image is for reference only, may not represent actual drive.

Above unit

Under unit

Note.

Air flows in the direction shown (back to front)

or in reverse direction (front to back)

Above unit

Under unit

Note.

Air flows in the direction shown or

in reverse direction (side to side)