HP BL460c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 25

Figure 18. Processor heat sink using fully ducted design (left) versus traditional heat sink in a 1U rack-mount server (right) Top view Side view Instant thermal monitoring provides a real-time view of heat, power, and cooling data. The BladeSystem Onboard Administrator retrieves thermal information from all server blades, storage blades, and interconnect modules in the enclosure to ensure an optimal balance between cooling, acoustic levels, and power consumption. The Thermal Logic technology in the BladeSystem Onboard Administrator keeps fan and system power at the lowest level possible. However, if the thermal load within the enclosure increases, the Thermal Logic feature instructs the fan controllers to increase fan speeds to accommodate the additional demand. If high temperature levels occur, the ProLiant Onboard Administrator (iLO 2) and BladeSystem Onboard Administrator modules provide alerts to various management tools such as HP Insight Control Environment and HP Systems Insight Manager. In addition, built-in failsafe procedures shut down devices in the enclosure if temperature levels exceed specified parameters. This prevents permanent damage to any devices within the enclosure. HP Thermal Logic includes sophisticated algorithms in each BladeSystem ROM, ProLiant Onboard Administrator (iLO 2), and BladeSystem Onboard Administrator. In combination, these algorithms minimize the power and cooling required to maintain the proper HP BladeSystem environment. Power supplies and enclosure power subsystem Expecting that power supply technology will advance during the lifecycle of the c7000 enclosure, HP designed the c7000 power subsystem to be flexible and upgradeable. Customers can choose from four types of HP BladeSystem c7000 Enclosures to select the one that will work best with their data center power infrastructure: Single-phase enclosure that accepts IEC C19-C20 power cords (available worldwide for use with in-rack power distribution units) Three-phase enclosure with a pair of US/Japan power cords with NEMA L15-30P power connectors Three-phase enclosure with a pair of international power cords with IEC 309, 5-Pin, 16A power connectors -48V DC Input Modules using a screw down terminal lug (45DG 4AWG 1/4 2H) 25