HP BL460c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 31

HP BladeSystem Power Sizer The HP BladeSystem Power Sizer is a tool that assists facilities teams and IT staff in sizing their power and cooling infrastructures to meet the needs of an HP BladeSystem solution. The BladeSystem Power Sizer is based on actual component-level power measurements of a system stressed to maximum capability. It allows a customer to select the type and number of components within each server blade and enclosure and to see the effect of changes on power consumption and heat loading. Values obtained from the BladeSystem Power Sizer tool are based on heavy enterprise application loads and are intended as guidelines only. Actual measured power consumption may be significantly lower or higher than the numbers provided by the Power Sizer. Power consumption will vary with application type, application utilization, and ambient temperature. The BladeSystem Power Sizer is available at this website: http://www.hp.com/go/bladesystem/powercalculator. Conclusion The HP BladeSystem c7000 Enclosure is the foundation of a modular computing architecture that consolidates and simplifies infrastructure, reduces operational cost, and delivers IT services more effectively. Thermal Logic technologies provide the mechanical design features, built-in monitoring, and control capabilities that enable IT administrators to optimize their power and thermal environments. The shared, high-speed, NonStop midplane and pooled-power backplane in the enclosure accommodate new bandwidths and new technologies. The BladeSystem Onboard Administrator supplies the infrastructure to provide essential power and cooling information and help to automate infrastructure management. The HP BladeSystem c7000 Enclosure provides all the power, cooling, and I/O infrastructure to support c-Class modular servers, interconnects, and storage components, today and for the next several years. 31