HP BL460c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 35

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For more information For additional information, refer to the resources listed below. Resource description General HP BladeSystem information HP BladeSystem c7000 Site Planning Guide HP BladeSystem c-Class documentation HP BladeSystem c-Class Enclosure Setup and Installation Guide HP BladeSystem Onboard Administrator User Guide HP BladeSystem c-Class interconnects Technical white papers and podcasts about HP BladeSystem HP BladeSystem Power Sizer Managing HP BladeSystem c-Class Systems technology brief HP ProLiant c-Class Server Blades technology brief HP BladeSystem c3000 Enclosure technology brief HP Power Capping and Dynamic Power Capping for ProLiant Servers technology brief HP Flex-10 technology Web address http://www.hp.com/go/bladesystem/ http://h20000.www2.hp.com/bc/docs/support/Support Manual/c01038153/c01038153.pdf http://h71028.www7.hp.com/enterprise/cache/3167350-0-0-121.html http://h20000.www2.hp.com/bc/docs/support/Support Manual/c00698286/c00698286.pdf http://h20000.www2.hp.com/bc/docs/support/Support Manual/c00705292/c00705292.pdf www.hp.com/go/bladesystem/interconnects http://h18004.www1.hp.com/products/servers/technolog y/whitepapers/proliant-servers.html http://www.hp.com/go/bladesystem/powercalculator http://h20000.www2.hp.com/bc/docs/support/Support Manual/c00814176/c00814176.pdf http://h20000.www2.hp.com/bc/docs/support/Support Manual/c01136096/c01136096.pdf http://h20000.www2.hp.com/bc/docs/support/Support Manual/c01508406/c01508406.pdf http://h20000.www2.hp.com/bc/docs/support/Support Manual/c01549455/c01549455.pdf?jumpid=reg_R1002 _USEN http://h20000.www2.hp.com/bc/docs/support/Support Manual/c01608922/c01608922.pdf Call to action Send comments about this paper to [email protected]. © 2006, 2008, 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. AMD is a trademark of Advanced Micro Devices, Inc. Linux is a U.S. registered trademark of Linus Torvalds. TC090606TB, June 2009

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For more information
For additional information, refer to the resources listed below.
Resource description
Web address
General HP BladeSystem information
HP BladeSystem c7000 Site Planning Guide
Manual/c01038153/c01038153.pdf
HP BladeSystem c-Class documentation
0-0-0-121.html
HP BladeSystem c-Class Enclosure Setup and
Installation Guide
Manual/c00698286/c00698286.pdf
HP BladeSystem Onboard Administrator User
Guide
Manual/c00705292/c00705292.pdf
HP BladeSystem c-Class interconnects
www.hp.com/go/bladesystem/interconnects
Technical white papers and podcasts about HP
BladeSystem
y/whitepapers/proliant-servers.html
HP BladeSystem Power Sizer
Managing HP BladeSystem c-Class Systems
technology brief
Manual/c00814176/c00814176.pdf
HP ProLiant c-Class Server Blades technology
brief
Manual/c01136096/c01136096.pdf
HP BladeSystem c3000 Enclosure technology
brief
Manual/c01508406/c01508406.pdf
HP Power Capping and Dynamic Power Capping
for ProLiant Servers technology brief
Manual/c01549455/c01549455.pdf?jumpid=reg_R1002
_USEN
HP Flex-10 technology
Manual/c01608922/c01608922.pdf
Call to action
Send comments about this paper to
.
© 2006, 2008, 2009 Hewlett-Packard Development Company, L.P. The
information contained herein is subject to change without notice. The only
warranties for HP products and services are set forth in the express warranty
statements accompanying such products and services. Nothing herein should
be construed as constituting an additional warranty. HP shall not be liable for
technical or editorial errors or omissions contained herein.
Microsoft and Windows are U.S. registered trademarks of Microsoft
Corporation.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation or
its subsidiaries in the United States and other countries.
AMD is a trademark of Advanced Micro Devices, Inc.
Linux is a U.S. registered trademark of Linus Torvalds.
TC090606TB, June 2009