HP BL460c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 5
Enclosure management
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Figure 3. HP BladeSystem c7000 Enclosure - side view Enclosure management The HP BladeSystem c7000 Enclosure has extensive embedded management capabilities based on three management elements: BladeSystem Onboard Administrator or BladeSystem Onboard Administrator with KVM ProLiant Onboard Administrator powered by Integrated Lights-Out 2 (iLO 2) management processors that are integrated on the server blades Interconnect module management processors such as the HP Virtual Connect Manager These integrated management elements provide powerful hardware management for remote administration and local diagnostics, as well as component and enclosure troubleshooting. For detailed information about c-Class management technologies and capabilities, refer to the HP white paper titled ―Managing HP BladeSystem c-Class systems‖: http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00814176/c00814176.pdf. BladeSystem Onboard Administrator The heart of c-Class enclosure management is the BladeSystem Onboard Administrator module located in the enclosure. It performs four management functions for the entire enclosure: Detecting component insertion and removal Identifying components and required connectivity Managing power and cooling Controlling components An optional second BladeSystem Onboard Administrator in the c7000 enclosure provides complete redundancy for these functions. IT administrators can access the BladeSystem Onboard Administrator in three different ways: remotely through the web browser graphical user interface (GUI), through the scriptable command line interface (CLI), or on site through the built-in Insight Display diagnostic LCD panel included in the front of every c-Class enclosure. 5