HP DL360 HP VMware ESXi management environment - Page 23

Data source, HP SIM with HP providers, VC/VIC with VMware providers, predicted to fail

Page 23 highlights

Data source Memory Subsystem, Version 2.0 only HP SIM with HP providers • Power supply temperature exceeded normal operating range • Power supply temperature returned to normal operating range • System memory capacity, starting and ending address, and health status • Individual memory module manufacturer, part number, serial number, removal conditions, data and total width, capacity, speed, type, position, form factor, bank label, SPD byte, location and health status • Individual memory board package type, removal conditions, hosting board, locked state, number of sockets, available memory size, total memory size, location and health status • Individual memory module slot connector layout, gender and description, location, and health status • Version2.0: memory redundancy set type, load balance algorithm, operating speed, available and total memory size, current, target and available configurations, and redundancy status • Version2.0: memory collection health status - Memory module has failed or is predicted to fail - Memory board error - Memory redundancy degraded - Memory recovered from degraded redundancy VC/VIC with VMware providers • Overall memory health status, and total physical system memory 23

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Data source
HP SIM with HP providers
VC/VIC with VMware providers
Power supply temperature exceeded
normal operating range
Power supply temperature returned to
normal operating range
Memory
Subsystem,
Version 2.0
only
System memory capacity, starting and
ending address, and health status
Individual memory module manufacturer,
part number, serial number, removal
conditions, data and total width, capacity,
speed, type, position, form factor, bank
label, SPD byte, location and health status
Individual memory board package type,
removal conditions, hosting board, locked
state, number of sockets, available memory
size, total memory size, location and health
status
Individual memory module slot connector
layout, gender and description, location,
and health status
Version2.0: memory redundancy set type,
load balance algorithm, operating speed,
available and total memory size, current,
target and available configurations, and
redundancy status
Version2.0: memory collection health status
Memory module has failed or is
predicted to fail
Memory board error
Memory redundancy degraded
Memory recovered from degraded
redundancy
Overall memory health status,
and total physical system memory
23