HP Integrity Superdome 2 HP Integrity Superdome 2 Site Preparation Guide (AH33 - Page 30
System specifications, Dimensions and weights, Component dimensions, Component weights - onboard administrator user guide
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2 System specifications Dimensions and weights Component dimensions Table 2-1 Component dimensions Component Compute enclosure Server blade I/O expansion enclosure Width (in/cm) 17.6/44.7 2.02/5.13 17.2/43.7 Depth (in/cm) 32.6/82.8 19.69/50.01 22.4/56.9 Height (in/cm) 31.4/79.8 24.48/62.18 6.9/17.4 For information on the dimensions of HP 10000 G2 Series racks, see the HP 10000 G2 Series User Guide. Component weights Table 2-2 Compute enclosure weights Component Compute enclosure chassis1 Weight (lb/kg) 143.0/64.9 I/O chassis 48.7/22.1 Midplane assembly 41.5/18.8 Onboard Administrator tray 8.0/3.6 Active Cool Fan 2.7/0.9 Power supply module 5.0/2.3 DVD module 4.7/2.1 Onboard Administrator module 1.8/0.8 GPSM 2.6/1.2 XFM 7.3/3.3 I/O interconnect module2 2.9/1.3 1 Does not include I/O chassis or midplane assembly. 2 Maximum weight for an interconnect module. Table 2-3 Other component weights Max quantity per enclosure 1 1 1 1 15 12 1 2 2 4 8 Component IOX enclosure1 CB900s i2 server blade2 Weight (lb/kg) 65.0/29.5 35.0/15.9 1 Fully loaded with all PCIe cards. 2 Fully loaded with all DIMMs and mezzanine cards. For information on the weight of HP 10000 G2 Series racks, see the HP 10000 G2 Series User Guide. For more information about general site preparation guidelines, see the Generic Site Preparation Guide. 30 System specifications