HP Pavilion dv6-3000 HP Pavilion dv6 Entertainment PC - Maintenance and Servic - Page 91

applied to the fan/heat sink assembly to correspond with components on the system board

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To remove the fan/heat sink assembly: 1. Turn the system board upside down, with the expansion port three and the external monitor port toward you. 2. Loosen the seven captive screws (1) that secure the fan/heat sink assembly to the system board. 3. Remove the fan/heat sink assembly (2). Disconnect the fan cable (3) from the system board. NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it might be necessary to move the fan/heat sink assembly from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is applied to the fan/heat sink assembly to correspond with components on the system board as follows: the processor (1) and (2), the Northbridge chip (3) and (4), the graphics subsystem chip (5) and (6), and three capacitors (7) and (8). Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. ENWW Component replacement procedures 83

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To remove the fan/heat sink assembly:
1.
Turn the system board upside down, with the expansion port three and the external monitor port
toward you.
2.
Loosen the seven captive screws (1) that secure the fan/heat sink assembly to the system board.
3.
Remove the fan/heat sink assembly (2). Disconnect the fan cable (3) from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it might be necessary to move the fan/heat sink
assembly from side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is
applied to the fan/heat sink assembly to correspond with components on the system board as
follows: the processor (1) and (2), the Northbridge chip (3) and (4), the graphics subsystem chip
(5) and (6), and three capacitors (7) and (8). Replacement thermal material is included with all
fan/heat sink assembly, system board, and processor spare part kits.
ENWW
Component replacement procedures
83