HP T5735 Hardware Reference Guide: HP Compaq t5730/t5735 Thin Clients - Page 6
Appendix C, Mounting the Thin Client, Thin Client Operation, Electrostatic Discharge
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Appendix C Mounting the Thin Client HP Quick Release ...23 Supported Mounting Options 25 Non-supported Mounting Option 27 Appendix D Thin Client Operation Routine Thin Client Care ...28 Supported Orientations ...28 Non-supported Orientation ...30 Appendix E Electrostatic Discharge Preventing Electrostatic Damage ...31 Grounding Methods ...31 Appendix F Shipping Information Shipping Preparation ...32 Important Service Repair Information 32 Index ...33 vi
Appendix C
Mounting the Thin Client
HP Quick Release
..............................................................................................................................
23
Supported Mounting Options
.............................................................................................
25
Non-supported Mounting Option
........................................................................................
27
Appendix D
Thin Client Operation
Routine Thin Client Care
....................................................................................................................
28
Supported Orientations
......................................................................................................................
28
Non-supported Orientation
.................................................................................................................
30
Appendix E
Electrostatic Discharge
Preventing Electrostatic Damage
.......................................................................................................
31
Grounding Methods
............................................................................................................................
31
Appendix F
Shipping Information
Shipping Preparation
..........................................................................................................................
32
Important Service Repair Information
.................................................................................................
32
Index
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33
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