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Intel BOXDP67BA Product Specification - Page 57

Reliability, Environmental

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Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 253,083 hours. 2.8 Environmental Table 33 lists the environmental specifications for the board. Table 33. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DP67BA Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Intended Audience	5
What This Document Contains	5
Typographical Conventions	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Legacy Considerations	16
1.3 Online Support	16
1.4 Processor	17
1.4.1 PCI Express x16 Graphics	17
1.5 System Memory	18
1.5.1 Memory Configurations	19
1.6 Intel® P67 Express Chipset	21
1.6.1 USB	21
1.7 SATA Interfaces	22
1.8 Real-Time Clock Subsystem	23
1.9 Legacy I/O Controller	23
1.9.1 Consumer Infrared (CIR)	24
1.10 Audio Subsystem	24
1.10.1 Audio Subsystem Software	25
1.10.2 Audio Subsystem Components	25
1.11 LAN Subsystem	26
1.11.1 Intel® 82579V Gigabit Ethernet Controller	26
1.11.2 LAN Subsystem Software	27
1.11.3 RJ-45 LAN Connector with Integrated LEDs	27
1.12 Hardware Management Subsystem	28
1.12.1 Hardware Monitoring	28
1.12.2 Fan Monitoring	28
1.12.3 Chassis Intrusion and Detection	28
1.12.4 Thermal Monitoring	29
1.13 Power Management	30
1.13.1 ACPI	30
1.13.2 Hardware Support	32
2 Technical Reference	37
2.1 Memory Resources	37
2.1.1 Addressable Memory	37
2.1.2 Memory Map	39
2.2 Connectors and Headers	39
2.2.1 Back Panel Connectors	40
2.2.2 Component-side Connectors and Headers	41
2.3 Jumper Block	50
2.4 Mechanical Considerations	52
2.4.1 Form Factor	52
2.5 Electrical Considerations	53
2.5.1 Power Supply Considerations	53
2.5.2 Fan Header Current Capability	54
2.5.3 Add-in Board Considerations	54
2.6 Thermal Considerations	54
2.7 Reliability	57
2.8 Environmental	57
3 Overview of BIOS Features	59
3.1 Introduction	59
3.2 BIOS Flash Memory Organization	60
3.3 Resource Configuration	60
3.3.1 PCI Autoconfiguration	60
3.4 System Management BIOS (SMBIOS)	61
3.5 Legacy USB Support	61
3.6 BIOS Updates	62
3.6.1 Language Support	62
3.6.2 Custom Splash Screen	63
3.7 BIOS Recovery	63
3.8 Boot Options	64
3.8.1 Optical Drive Boot	64
3.8.2 Network Boot	64
3.8.3 Booting Without Attached Devices	64
3.8.4 Changing the Default Boot Device During POST	64
3.9 Adjusting Boot Speed	65
3.9.1 Peripheral Selection and Configuration	65
3.9.2 BIOS Boot Optimizations	65
3.10 BIOS Security Features	66
3.11 BIOS Performance Features	67
4 Error Messages and Beep Codes	69
4.1 Speaker	69
4.2 BIOS Beep Codes	69
4.3 Front-panel Power LED Blink Codes	70
4.4 BIOS Error Messages	70
4.5 Port 80h POST Codes	71
5 Regulatory Compliance and Battery Disposal Information	77
5.1 Regulatory Compliance	77
5.1.1 Safety Standards	77
5.1.2 European Union Declaration of Conformity Statement	78
5.1.3 Product Ecology Statements	79
5.1.4 EMC Regulations	81
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	84
5.1.6 Regulatory Compliance Marks (Board Level)	85