Intel DH55TC DH55TC Technical Product Specification - Page 55

Localized High Temperature Zones, Table 29., Thermal Considerations for Components - update

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Technical Reference Figure 16 shows the locations of the localized high temperature zones. Item A B C Description Processor voltage regulator area Processor Intel H55 Express Chipset Figure 16. Localized High Temperature Zones Table 29 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 29. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H55 Express Chipset 111 oC 55

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Technical Reference
55
Figure 16 shows the locations of the localized high temperature zones.
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel H55 Express Chipset
Figure 16.
Localized High Temperature Zones
Table 29 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 29.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H55 Express Chipset
111
o
C