Intel DH55TC DH55TC Technical Product Specification - Page 56
Table 30., Tcontrol Values for Components
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Intel Desktop Board DH55TC Technical Product Specification To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 29. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol, as shown in Table 30. Table 30. Tcontrol Values for Components Component Tcontrol Processor For processor case temperature, see processor datasheets and processor specification updates Intel H55 Express Chipset 107 oC For information about Processor datasheets and specification updates Refer to Section 1.3, page 14 56