Intel DX79SI Intel Desktop Board DX79SI Technical Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables - support

Page 9 highlights

Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 85 5.1.1 Safety Standards 85 5.1.2 European Union Declaration of Conformity Statement 86 5.1.3 5.1.4 5.1.5 Product Ecology Statements 87 EMC Regulations 89 ENERGY STAR* 5.0, e-Standby, and ErP Compliance 92 5.1.6 Regulatory Compliance Marks (Board Level 93 5.2 Battery Disposal Information 94 Figures 1. Major Board Components 13 2. Block Diagram 15 3. Memory Channel and DIMM Configuration 20 4. Back Panel Audio Connectors 25 5. LAN Connector LED Locations 27 6. Bluetooth/WiFi Module 28 7. Thermal Sensors and Fan Headers 31 8. Location of Board Status LEDs 39 9. Location of the Onboard Power and Reset Buttons 41 10. Detailed System Memory Address Map 44 11. Back Panel Connectors 46 12. I/O Shield Reference Diagram 47 13. Component-side Connectors and Headers 48 14. Connection Diagram for Front Panel Header 55 15. Connection Diagram for Front Panel USB 2.0 Headers 57 16. Location of the Jumper Block 58 17. Board Dimensions 60 18. Localized High Temperature Zones 64 Tables 1. Feature Summary 11 2. Components Shown in Figure 1 14 3. Supported Memory Configurations 18 4. Audio Jack Support 24 5. LAN Connector LED States 27 6. Effects of Pressing the Power Switch 32 7. Power States and Targeted System Power 33 8. Wake-up Devices and Events 34 9. Board Status LEDs 40 10. System Memory Map 45 11. Component-side Connectors and Headers Shown in Figure 13 49 12. Front Panel Audio Header for Intel HD Audio 50 13. Front Panel Audio Header for AC '97 Audio 50 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
......................................................................
85
5.1.1
Safety Standards
...................................................................
85
5.1.2
European Union Declaration of Conformity Statement
................
86
5.1.3
Product Ecology Statements
...................................................
87
5.1.4
EMC Regulations
...................................................................
89
5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
.................
92
5.1.6
Regulatory Compliance Marks (Board Level)
.............................
93
5.2
Battery Disposal Information
..............................................................
94
Figures
1.
Major Board Components
..................................................................
13
2.
Block Diagram
..................................................................................
15
3.
Memory Channel and DIMM Configuration
............................................
20
4.
Back Panel Audio Connectors
.............................................................
25
5.
LAN Connector LED Locations
.............................................................
27
6.
Bluetooth/WiFi Module
......................................................................
28
7.
Thermal Sensors and Fan Headers
......................................................
31
8.
Location of Board Status LEDs
............................................................
39
9.
Location of the Onboard Power and Reset Buttons
................................
41
10. Detailed System Memory Address Map
................................................
44
11. Back Panel Connectors
......................................................................
46
12. I/O Shield Reference Diagram
............................................................
47
13. Component-side Connectors and Headers
............................................
48
14. Connection Diagram for Front Panel Header
.........................................
55
15. Connection Diagram for Front Panel USB 2.0 Headers
...........................
57
16. Location of the Jumper Block
.............................................................
58
17. Board Dimensions
.............................................................................
60
18. Localized High Temperature Zones
.....................................................
64
Tables
1.
Feature Summary
.............................................................................
11
2.
Components Shown in Figure 1
..........................................................
14
3.
Supported Memory Configurations
......................................................
18
4.
Audio Jack Support
...........................................................................
24
5.
LAN Connector LED States
.................................................................
27
6.
Effects of Pressing the Power Switch
...................................................
32
7.
Power States and Targeted System Power
...........................................
33
8.
Wake-up Devices and Events
.............................................................
34
9.
Board Status LEDs
............................................................................
40
10. System Memory Map
.........................................................................
45
11. Component-side Connectors and Headers Shown in Figure 13
................
49
12. Front Panel Audio Header for Intel HD Audio
........................................
50
13. Front Panel Audio Header for AC ’97 Audio
...........................................
50