Intel E6420 Design Guidelines - Page 106

Filling Groove with Adhesive, Application of Accelerant

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Case Temperature Reference Metrology 36. Clean the surface of the IHS with Alcohol and use compressed air to remove any remaining contaminants. 37. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove (see Figure 7-33). Figure 7-33. Filling Groove with Adhesive 38. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive and let it set for a couple of minutes (see Figure 7-34). Figure 7-34. Application of Accelerant 106 Thermal and Mechanical Design Guidelines

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Case Temperature Reference Metrology
106
Thermal and Mechanical Design Guidelines
36. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
37. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (see Figure 7-33).
Figure 7-33. Filling Groove with Adhesive
38. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (see Figure 7-34).
Figure 7-34. Application of Accelerant