Intel E6420 Design Guidelines - Page 41

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.1 5.1.1 Overview of the Balanced Technology Extended (BTX) Reference Design The reference thermal module assembly is a Type II BTX compliant design and is compliant with the reference BTX motherboard keep-out and height recommendations defined Section 6.6. The solution comes as an integrated assembly. An isometric view of the assembly is provided Figure 5-4. Target Heatsink Performance Table 5-1 provides the target heatsink performance for the processor with the BTX boundary conditions. The results will be evaluated using the test procedure described in Section 5.2. The table also includes a TA assumption of 35.5 °C for the Intel reference thermal solution at the processor fan heatsink inlet discussed Section 3.3. The analysis assumes a uniform external ambient temperature to the chassis of 35 °C across the fan inlet, resulting in a temperature rise, TR, of 0.5 °C. Meeting TA and CA targets can maximize processor performance (refer to Sections 2.2, 2.4. and Chapter 4). Minimizing TR, can lead to improved acoustics. Thermal and Mechanical Design Guidelines 41