Toshiba TS605 Service Manual - Page 98

Mobile Communications Division Customer Services 7.3 ACF - ANISOTROPIC CONDUCTIVE FILM ACF is a reliable, cheap and efficient way of bonding. On the TS608 ACF Technology has been used to bond the following components to the PCB LCD Module CMOS / Camera Module Keypad Module MP3 FPC Module In order to replace such components, it must be understood the exact requirements and exactly what is required. Due to the high reliability accompanied by ACF technology it should be a rare occurrence that means a replacement. Consider the following diagrams to understand the actual bond. As you can see, there are many particles spread across the PCB and FPC, some are bonded and some are not. Because of the many particles, an open circuit (dry joint) is unlikely as, if one particle goes open there are many more to secure the connection. This same type of bonding has been used for years on technologies such as Laptop's. How many LCD's have you seen go blank on a phone and how many on a Laptop? There are 2 ways of bonding. You can use ACF Tape and Shown below: Version 1.0 14/08/2006 Created by Konrad Szombara Page 98 of 103