Asus M3N WS User Manual - Page 38
DDR2-667MHz capability for AM2 CPU
UPC - 610839162406
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M3N WS Motherboard Qualified Vendors Lists (QVL) DDR2-667MHz capability for AM2 CPU Vendor Part No. Size SS/ DS A-DATA M2OAD5G3H3166I1C52 512MB SS A-DATA M2OAD5G3I4176I1C52 1GB DS A-DATA M2ONY5H3J4170I1C5Z 2GB DS Apacer 78.01G9O.9K5 1GB SS Apacer 78.91G92.9K5 512MB SS Apacer 78.A1G9O.9K4 2GB DS CORSAIR VS 512MB667D2 512MB SS CORSAIR VS1GB667D2 1GB DS crucial BL6464AA663.8FD 512MB SS crucial BL12864AA663.16FD 1GB DS ELPIDA EBE51UD8AEFA-6E-E 512MB SS G.SKILL F2-5300CL5D-4GBMQ 4GB (Kit of 2) DS G.SKILL F2-5400PHU2-2GBNT 2GB (Kit of 2) DS GEIL GX21GB5300SX 1GB DS GEIL GX22GB5300LX 2GB DS GEIL GX24GB5300LDC 4GB (Kit of 2) DS Hynix HYMP 512U64CP8-Y5 1GB DS Kingmax KLCC28F-A8KB5 512MB SS Kingmax KLCD48F-A8KB5 1GB DS KINGSTON KVR667D2N5/ 512 512MB SS KINGSTON KVR667D2E5/1G 1GB DS KINGSTON KVR667D2E5/2G 2GB DS KINGSTON KVR667D2N5/1G 1GB DS KINGSTON KVR667D2N5/2G 2GB DS KINGSTON KVR667D2N5/2G 2GB DS NANYA NT 512T64U88B0BY-3C 512MB SS NANYA NT2GT64U8HB0JY-3C 2GB DS PSC AL7E8E63J-6E1 1GB DS Qimonda HYS64T256020EU-3S-C2 2GB DS SAMSUNG M378T6553EZS-CE6 512MB SS SAMSUNG M378T2953EZ3-CE6 1GB DS SAMSUNG M378T5263AZ3-CE6 4GB DS Super Talent T6UA 512C5 512MB SS Super Talent T6UB1GC5 1GB DS Transcend JM667QLU-1G 1GB SS Chip No. AD29608A8A-3EG AD29608A8A-3EG NT5TU128M8BJ-3C AM4B5808CQJS7E AM4B5708JQJS7E AM4B5808CQJS7E 64M8CFEG 64M8CFEG Heat-Sink Package Heat-Sink Package E5108AE-6E-E Heat-Sink Package CL Chip Brand 5 A-DATA 5 A-DATA N/A N/A N/A APACER N/A APACER N/A APACER N/A N/A N/A N/A 3 N/A 3 N/A 5 ELPIDA 5-5-5-15 N/A DIMM socket support (Optional) A* B* C* • • • • • • • • • • • • • • • • • • • • • • D264M8GCF 5-5-5-15 G.SKILL • • Heat-Sink Package Heat-Sink Package 3-4-4-8 N/A 5-5-5-15 N/A • • • • • • Heat-Sink Package 5-5-5-15 N/A • • • HY5PS12821CFP-Y5 5 KKEA88B4LAUG-29DX 5 KKEA88B4LAUG-29DX 5 D6408TEBGGL3U 5 E5108AGBG-6E-E N/A D9HNL N/A E5108AGBG-6E-E N/A E1108AB-6E-E N/A HY5PS1G831CFP-Y5 N/A NT5TU64M8BE-3C 5 NT5TU128M8BJ-3C 5 A3R12E3JFF719A9T02 5 HYB18T1GB00C2F-3S 5 K4T51083QE 5 K4T51083QE 5 K4T2G084QA-HCE6 5 Hynix • • • KINGMAX • • • KINGMAX • KINGSTON • • ELPIDA • • • MICRON • • • KINGSTON • • • ELPIDA • • Hynix • • • NANYA • • • NANYA • • • PSC • • • QIMONDA • • SAMSUNG • • SAMSUNG • • • SAMSUNG • • Heat-Sink Package 5 N/A • • Heat-Sink Package 5 TQ243ECF8 5 N/A • • • Transcend • • 2-14 Chapter 2: Hardware information