Asus P5K3 Premium WiFi-AP User Manual - Page 18

1.3 Special features 1.3.1 Product highlights Intel® Quad-core Processor Ready This motherboard supports the latest Intel® Quad-core processors in the LGA775 package. It is excellent for multi-tasking, multi-media and enthusiastic gamers with 1066 / 800 MHz FSB. Intel® Quad-core processor is one of the most powerful CPU in the world. This motherboard also supports Intel® CPUs in the new 45 nm manufacturing process. Intel® Core™2 Duo/ Intel® Core™2 Extreme CPU support This motherboard supports the latest Intel® Core™2 processor in the LGA775 package. With the new Intel® Core™ microarchitecture technology and 1333/ 1066 / 800 MHz FSB, the Intel® Core™2 is one of the most powerful and energy efficient CPUs in the world. Intel P35 Chipset The Intel® P35 Express Chipset is the latest chipset designed to support 8GB of dual-channel DDR3 1066/800 architecture, 1333/1066/800 FSB (Front Side Bus), PCI Express x16 graphics and multi-core CPU. It especially includes Intel® Fast Memory Access technology that significantly optimizes the use of available memory bandwidth and reduces the latency of the memory accesses. Turbo D3 The Turbo D3 is an onboard memory feature that provides users with memory overclocking above DDR3 1600MHz. An innovative 10-layer design provides good power delivery, low latency without zero reflection signals, and a high frequency response that makes it easy to reach higher overclocking frequencies -- allowing users to enjoy enhanced performance and faster speeds. Refer to page 2-13 for details. Super Memspeed Technology To attain top performance, ASUS has managed to break through current FSB and DRAM ratio proportions by utilizing Super Memspeed Technology- the latest technology that provides even more precise overclocking options to unleash the true potential of DDR3 memory. Native DDR3 1333 maximizes system performance by eliminating the bottleneck when overclocking both the CPU and the memory- providing great performance for 3D graphics and other memory demanding applications. Refer to page 2-13 for details. 1- Chapter 1: Product Introduction