Canon EOS 1D Mark III User Guide - Page 33

Electronic Components, RoHS Compatibility - video

Page 33 highlights

Electronic Components The main electronic boards are the imaging-control board, digital-control board, cameracontrol board, display-control board, and power supply board. There are also flexible boards mounted with various sensors and other boards and flexible boards. There are 15 hard boards and 27 flexible boards (including FFC). 1) Imaging-control board This board outputs the pulse controlling the driving of the CMOS sensor. It also converts the analog signal output from the CMOS sensor into a digital signal for output. For the EOS-1D Mark III, it also has an EEPROM to store the analog system's adjustment values. 2) Digital-control board This has the DIGIC III and other digital image-processing circuits, a memory circuit which includes the DDR SDRAM for the image buffer memory, and various TFT driver circuits for the TFT monitor's display control. This board has connectors to enable connection with interfaces such as USB, VIDEO, extension system terminal for the WFT-E2A, CF card, and SD memory card. 3) Camera-control board This board has the main microcomputer IC for camera operation control. It controls various sensors and mechanical components. It also has an IC for AF control, EFIC as the interface for the lens and external Speedlite, and EEPROM to save various adjustment data. 4) Display-control board Equipped with the display IC for driving and controlling the LCD panel, viewfinder display, and superimposed display. It also has the motor driver IC for the drive control of the shutter's motor. 5) Power supply board This board has the power supply circuit and supplies power from this board to the camera's various boards. 6) Self Cleaning Sensor Unit board This board is for driving and controlling the Self Cleaning Sensor Unit. It consists of the power supply section, an oscillator circuit to generate the drive signal, the driver section which outputs the drive signal, and the sensor circuit which detects the oscillator condition. It is controlled by a signal from the camera control board. RoHS Compatibility The RoHS directive (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) restricts the use of six toxic substances: Lead, mercury, cadmium, hexavalent chromium, SI mirror Metering sensor SI lens Metering lens Pentaprism Condenser lens Laser Matte surface Focusing screen polybrominated biphenyl, and polybrominated diphenyl ether. It applies to products sold in the EU. All of the EOS-1D Mark III's parts conform to this directive. 45 main reflex mirror Fully-reflective mirror Fixed aperture Infrared-absorption filter Secondary image-forming lens Lithium-ion battery VIII. ROCK SOLID RELIABILITY SI lens S-LCD SI dome lens 1 SI dome lens 2 SI-LED Eyepiece lens 4 Eyepiece lens 3 Eyepiece lens 1 Eyepiece lens 2 SI dichroic mirror H-LCD H-LCD prism Image sensor Low-pass filter Secondary mirror LCD monitor AF sensor Rear LCD panel 33

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VIII. ROCK SOLID RELIABILITY
33
Electronic Components
RoHS Compatibility
The main electronic boards are the imaging-control board, digital-control board, camera-
control board, display-control board, and power supply board. There are also flexible
boards mounted with various sensors and other boards and flexible boards. There are
15 hard boards and 27 flexible boards (including FFC).
1) Imaging-control board
This board outputs the pulse controlling the driving of the CMOS sensor. It also converts
the analog signal output from the CMOS sensor into a digital signal for output. For the
EOS-1D Mark III, it also has an EEPROM to store the analog system's adjustment values.
2) Digital-control board
This has the DIGIC III and other digital image-processing circuits, a memory circuit which
includes the DDR SDRAM for the image buffer memory, and various TFT driver circuits for
the TFT monitor's display control. This board has connectors to enable connection with
interfaces such as USB, VIDEO, extension system terminal for the WFT-E2A, CF card, and
SD memory card.
3) Camera-control board
This board has the main microcomputer IC for camera operation control.
It controls various
sensors and mechanical components. It also has an IC for AF control, EFIC as the interface
for the lens and external Speedlite, and EEPROM to save various adjustment data.
4) Display-control board
Equipped with the display IC for driving and controlling the LCD panel, viewfinder display,
and superimposed display. It also has the motor driver IC for the drive control of the
shutter's motor.
5) Power supply board
This board has the power supply circuit and supplies power from this board to the
camera's various boards.
6) Self Cleaning Sensor Unit board
This board is for driving and controlling the Self Cleaning Sensor Unit. It consists of the
power supply section, an oscillator circuit to generate the drive signal, the driver section
which outputs the drive signal, and the sensor circuit which detects the oscillator
condition. It is controlled by a signal from the camera control board.
The RoHS directive (Restriction of the use of certain
Hazardous Substances in electrical and electronic
equipment) restricts the use of six toxic substances:
Lead, mercury, cadmium, hexavalent chromium,
polybrominated biphenyl, and polybrominated
diphenyl ether. It applies to products sold in the
EU. All of the EOS-1D Mark III's parts conform to
this directive.
SI lens
S-LCD
SI dome lens 1
SI dome lens 2
SI-LED
Eyepiece lens 4
Eyepiece lens 3
Eyepiece lens 1
Eyepiece lens 2
SI dichroic mirror
H-LCD
H-LCD prism
Image sensor
Low-pass filter
Secondary mirror
LCD monitor
AF sensor
Rear LCD panel
Lithium-ion battery
Secondary
image-forming lens
Infrared-absorption filter
Fixed aperture
Fully-reflective mirror
Focusing
screen
Laser Matte surface
Condenser lens
Pentaprism
Metering lens
SI lens
Metering sensor
SI mirror
45
main reflex mirror