Dell PowerEdge R650 EMC Technical Specifications - Page 16
Thermal restriction for liquid cooling, Table 19. Maximum shock pulse specifications
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Table 19. Maximum shock pulse specifications Maximum shock pulse Specifications Operating Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms. Storage Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms. Thermal restriction for liquid cooling Table 20. Label references Label references STD HPR HSK LP FH DW Standard High Performance Heat sink Low Profile (Riser) Full Height (Riser) Double Wide (Xilinx FPGA accelerator) Table 21. Cooling fan matrix for liquid cooling Configuration 4 x 3.5-inch 8 x 2.5-inch Rear storage 3 LP/ 2 FH Rear 2 x 2.5-inch Rear 2 x 2.5- inch NVMe 3 LP/ 2 FH CPU TDP 105 W-270 W 64 GB RDIMM 128 GB LRDIMM 256 GB Memory LRDIMM HPR SLVR fan HPR SLVR fan Optane Persistent Memory 200 series (Barlow Pass) Without Barlow Pass HPR SLVR fan 70 W T4 GPU Barlow Pass + 64 GB RDIMM Barlow Pass + 128 GB LRDIMM or higher HPR SLVR fan HPR Gold fan 10 x 2.5-inch SAS 3 LP/ 2 FH Rear 2 x 2.5-inch SAS HPR SLVR fan HPR SLVR fan HPR Gold fan 10 x 2.5-inch NVMe 3 LP/ 2 FH Rear 2 x 2.5-inch NVMe HPR SLVR fan HPR SLVR fan HPR Gold fan 16 Technical specifications