Dell PowerEdge R650 EMC Technical Specifications - Page 21

Table 26. Particulate contamination specifications, continued, Particulate contamination

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Table 26. Particulate contamination specifications (continued) Particulate contamination Specifications NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. NOTE: Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127 Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. NOTE: Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles Corrosive dust ● Air must be free of corrosive dust. ● Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. Table 27. Gaseous contamination specifications Gaseous contamination Copper Coupon Corrosion rate Silver Coupon Corrosion rate Specifications

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Table 26. Particulate contamination specifications
(continued)
Particulate contamination
Specifications
NOTE:
This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE:
Air entering the data center must have MERV11 or
MERV13 filtration.
NOTE:
Air filtering can also be accomplished by filtering
room air with MERV8 filter per ANSI/ASHRAE Standard
127
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE:
This condition applies to data center and non-data
center environments.
NOTE:
Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles
Corrosive dust
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE:
This condition applies to data center and non-data
center environments.
Table 27. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper Coupon Corrosion rate
<300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Technical specifications
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