Dell PowerEdge R650 EMC Technical Specifications - Page 19

Table 25. T4 GPU support restriction (continued) Slots 2.5-inch x 10 2.5-inch x 8 Rear 3 x LP Config 2 x FH 3 x LP Slot 2 Supported Supported Supported Slot 3 Supported NA Supported 2 x FH Supported NA 3.5-inch x 4 3 x LP 2 x FH Supported Supported Supported NA Thermal restrictions for Non GPU/BPS configurations at 35°C environment: ● For 3.5-inch configuration: ○ No support for CPU > 225 W in 35°C environment. ● For 2.5-inch configuration: ○ No support for CPU > 250 W in rear NVMe configuration in 35°C environment. ○ No support for LRDIMM ≥ 128 GB if CPU ≥ 240 W for 10 x 2.5-inch HDD/NVMe in 35°C environment. Thermal restrictions for T4 GPU at 35°C environment: ● For 3.5-inch configuration: ○ No support for LRDIMM ≥ 128 GB with T4 GPU. ○ T4 GPU not supported when CPU TDP > 205 W. ○ HPR SLVR fan is required. ● For 2.5-inch configuration: ○ No support for LRDIMM ≥ 128 GB with T4 GPU if CPU > 205 W. ○ HPR GOLD fan is required Thermal restrictions for Optane Persistent Memory 200 series (BPS and 256 GB LRDIMM) at 35°C environment: ● For 3.5-inch configuration, ○ HPR SLVR fan is required. ○ BPS / 256 GB LRDIMM is not supported when: ￭ CPU TDP > 165 W. ￭ GPU is installed. ￭ Rear drive is present. ● For 2.5-inch configuration: ○ HPR GOLD fan is required. ○ All NVMe 10 x 2.5-inch configuration is not supported if CPU TDP > 255 W. ○ 10 x 2.5-inch SAS/SATA with rear drive configuration is not supported if CPU TDP > 225 W. ○ No support for LRDIMM ≥ 128 GB along with BPS if CPU > 165 W ○ No support for 256 GB LRDIMM if CPU > 165 W 30°C configuration support for 2.5-inch storage module configuration ● For non GPU/BPS configuration ○ Up to 30°C ambient temperature support for CPU TDP 250 W - 270 W with 128 GB LRDIMM in rear drive configuration. ○ Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with 64 GB RDIMM in rear NVMe configuration. ● With GPU configuration ○ Up to 30°C ambient temperature support for CPU TDP 210 W - 270 W with GPU and 128 GB LRDIMM. ○ Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with GPU and 64 GB RDIMM in rear NVMe configuration. ● With BPS / 256 GB LRDIMM configuration ○ Up to 30°C ambient temperature support for CPU TDP 185 W - 270 W with BPS and 128 GB / 256 GB LRDIMM or 256 GB LRDIMM ○ Up to 30°C ambient temperature support for CPU TDP 230 W - 270 W with BPS and 64 GB RDIMM in rear drive configuration. ○ Up to 30°C ambient temperature support for CPU TDP 185 W - 270 W with GPU T4, BPS and 128 GB / 256 GB LRDIMM or GPU T4 and 256 GB LRDIMM ○ Up to 30°C ambient temperature support for CPU TDP 230 W - 270 W with GPU T4, BPS and 64 GB RDIMM in rear drive configuration. ○ Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with BPS and 64 GB RDIMM in NVMe configuration. ○ Up to 30°C ambient temperature support for CPU TDP 260 W - 270 W with GPU T4, BPS and 64 GB RDIMM in NVMe configuration. Other restrictions for Air cooling Technical specifications 19